MC68360ZP25L

IC MPU M683XX 25MHZ 357BGA
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)

Quantity 645 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package357-PBGA (25x25)
ECCNEAR99Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 70°C (TA)
Package / Case357-BGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed25MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O5.0V

Overview of MC68360ZP25L – IC MPU M683XX 25MHZ 357BGA

The MC68360ZP25L is a CPU32+ microprocessor from NXP Semiconductors' MC68360 series, implementing a single 32‑bit CPU32+ core running at 25 MHz. It is built on the QUICC (QUad Integrated Communications Controller) architecture and integrates communications-focused subsystems for embedded designs.

Targeted at embedded communications and control applications, the device combines a Communications Processor Module (CPM), DRAM controller, serial communications channels (SCC), and a 10 Mbps Ethernet interface to support networked embedded systems and communications equipment. The device is supplied in a 357‑PBGA (25×25) surface‑mount package and is RoHS compliant.

Key Features

  • CPU32+ 32‑bit Core — Single 32‑bit CPU32+ core running at 25 MHz for deterministic embedded processing.
  • QUICC Communications Architecture — Based on the MC68360 QUICC family with an integrated Communications Processor Module (CPM) and System Integration Module (SIM60) referenced in the device documentation.
  • Integrated Communications Engines — Co‑processor support for communications (CPM) and serial channel interfaces (SCC) for protocol and serial data handling.
  • DRAM Controller — On‑chip support for DRAM to enable external memory interfacing for buffering and application code storage.
  • 10 Mbps Ethernet — Single Ethernet interface supporting 10 Mbps connectivity for networked applications.
  • 5 V I/O — Device I/O referenced to 5 V for compatibility with legacy embedded systems.
  • Package & Mounting — 357‑PBGA (25×25) package, surface mount for compact board integration.
  • Operating Range — Specified operating temperature from 0 °C to 70 °C for standard commercial environments.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

  • Embedded Communications Control — Use the integrated CPM and SCC resources to implement protocol handling and serial communications in embedded systems.
  • Networked Embedded Systems — The on‑chip 10 Mbps Ethernet interface and DRAM controller enable network connectivity and local buffering for devices on legacy Ethernet segments.
  • Industrial and Telecom Equipment — QUICC architecture and communications co‑processing suit the device for communication‑centric control functions in industrial and telecom gear.
  • Memory‑Assisted Applications — DRAM controller support allows designs that require external memory for runtime data and code storage.

Unique Advantages

  • Communications‑Focused Integration: Built‑in CPM and SCC interfaces reduce external component needs for serial and communications tasks.
  • Deterministic 32‑Bit Processing: CPU32+ single‑core 32‑bit architecture at 25 MHz provides predictable performance for embedded control loops and protocol stacks.
  • On‑Chip Memory Controller: DRAM controller simplifies memory subsystem design and supports larger buffering for networking workloads.
  • Legacy Network Support: Native 10 Mbps Ethernet enables direct integration into existing 10BASE‑T infrastructure.
  • Commercial Temperature and 5 V I/O: Specification for 0 °C to 70 °C operation and 5 V I/O makes it compatible with many standard embedded platforms.
  • Compact Surface‑Mount Package: 357‑PBGA (25×25) format supports high‑density board layouts while remaining manufacturable with standard SMT processes.

Why Choose MC68360ZP25L?

The MC68360ZP25L positions itself as a communications‑centric, integrated microprocessor solution within the MC68360 series. Its CPU32+ core, CPM communications engine, DRAM controller, SCC interfaces, and 10 Mbps Ethernet combine to address embedded designs that require on‑chip communications processing and external memory support in a compact 357‑PBGA package.

This device is suited to engineers developing networked embedded controllers, communications equipment, or industrial systems operating in commercial temperature environments who require a solution with built‑in communications peripherals and standard 5 V I/O. RoHS compliance and the QUICC architectural lineage add to long‑term design consistency and ecosystem support.

Request a quote or submit an RFQ to receive pricing, availability, and lead‑time information for the MC68360ZP25L.

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