MCC5E0RX266WB0B

The MCC5E0RX266WB0B is a microprocessor IC from NXP Semiconductors, offered as part of the MCC5 series. It provides a 266 MHz operating speed in an 840‑FCCBGA (31×31) supplier device package and is intended for embedded applications requiring surface‑mount, high‑density integration.

Key Features

• Processing Speed  266 MHz operating speed for embedded processing tasks.
• 840‑FCCBGA (31×31) Package  High‑density BGA supplier device package (31×31) to support compact board layouts.
• Surface‑Mount Compatibility  Designed for surface‑mount assembly per the specified mounting type.
• Bulk Packaging  Supplied in a bulk package case suitable for volume production.
• MCC5 Series by NXP Semiconductors  Part of the MCC5 series, manufactured by NXP Semiconductors.
• RoHS Status  Not specified in available product data.

Typical Applications

• Embedded Systems  Acts as the central processor for embedded applications that require a 266 MHz microprocessor in a compact BGA footprint.
• Control and Automation  Integrates into surface‑mount control modules where high‑density packaging is required.
• High‑Density Board Designs  The 31×31 BGA package supports space‑constrained layouts and compact assemblies.

Unique Advantages

• Consistent 266 MHz Performance  Delivers the specified operating frequency for predictable embedded processing.
• High‑Density BGA Form Factor  840‑FCCBGA (31×31) supplier package enables compact, high‑component‑density PCBs.
• Surface‑Mount Ready  Mounting type specified as Surface Mount for compatibility with modern SMT assembly processes.
• Volume‑Friendly Packaging  Bulk package case supports production‑level procurement and assembly workflows.
• Manufacturer Backing  Produced by NXP Semiconductors as part of the MCC5 series.

Why Choose MCC5E0RX266WB0B?

The MCC5E0RX266WB0B combines a 266 MHz microprocessor capability with a high‑density 840‑FCCBGA (31×31) package, providing a compact solution for embedded designs that require surface‑mount integration. Its bulk packaging and defined mounting type make it suitable for production assembly processes.

As a member of the MCC5 series from NXP Semiconductors, this part offers a clear specification profile for engineers sourcing a 266 MHz microprocessor in a 31×31 BGA form factor.

Request a quote or submit an inquiry to receive pricing and availability information for MCC5E0RX266WB0B.