MPF300TLS-FCVG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 21094400 300000 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,347 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21094400 |
Overview of MPF300TLS-FCVG484I – PolarFire™ FPGA IC, 300,000 logic elements, 484-FCBGA
The MPF300TLS-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-capacity programmable logic fabric intended for industrial and embedded applications that require significant logic resources and dense I/O.
Key on-chip resources include 300,000 logic elements and approximately 21.09 Mbits of embedded memory, combined with 284 user I/Os and a compact 484-FCBGA (19×19) surface-mount package. The device is specified for industrial-grade operation across a wide temperature range.
Key Features
- Logic Capacity 300,000 logic elements to implement complex custom logic, accelerators, and control functions.
- Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
- I/O Density 284 user I/Os for flexible interfacing with peripherals, sensors, and external devices.
- Power Core supply specified from 0.97 V to 1.08 V to match system power-domain requirements.
- Package and Mounting 484-FCBGA (19×19) package, surface-mount 484-BBGA/FCBGA format for high-density board integration.
- Industrial Operating Range Rated for operation from –40 °C to 100 °C and designated as Industrial grade.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Industrial-grade temperature range and substantial logic capacity support control and automation functions in harsh environments.
- Embedded Processing Large logic fabric and approximately 21.09 Mbits of embedded memory enable custom accelerators and complex embedded data handling.
- I/O-Intensive Instrumentation 284 user I/Os provide the connectivity required for dense sensor interfaces, data acquisition, and communication peripherals.
Unique Advantages
- High Logic Density: 300,000 logic elements allow implementation of sizable custom logic and multi-function designs without external glue logic.
- Significant On-Chip Memory: Approximately 21.09 Mbits of embedded RAM reduces dependence on external memory for many buffering and table needs.
- Generous I/O Count: 284 user I/Os enable flexible system partitioning and broad peripheral connectivity.
- Industrial Qualification: Specified for –40 °C to 100 °C operation and listed as Industrial grade for deployments in demanding environments.
- Compact BGA Package: 484-FCBGA (19×19) supports high-density PCB layouts while maintaining surface-mount assembly compatibility.
- Tight Core Voltage Window: Core supply range of 0.97 V to 1.08 V supports precise power-domain management.
Why Choose MPF300TLS-FCVG484I?
The MPF300TLS-FCVG484I positions a sizable, industrial-grade PolarFire™ FPGA in a compact 484-FCBGA package, balancing high logic capacity, substantial embedded memory, and broad I/O for demanding embedded and industrial designs. Its specified operating temperature range and RoHS compliance make it suitable for long-term deployment in controlled and harsh environments.
This device is appropriate for designers who need large on-chip resources (logic and RAM) combined with extensive I/O in a surface-mount BGA footprint. The combination of these specifications supports scalable designs where integration, reliability, and predictable supply-domain behavior are important.
Request a quote or submit an inquiry to receive pricing and availability for the MPF300TLS-FCVG484I.

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