MPF300TLS-FCSG536I

IC FPGA 300 I/O 536CSPBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 300 21094400 300000 536-LFBGA, CSPBGA

Quantity 278 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O300Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs75000Number of Logic Elements/Cells300000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits21094400

Overview of MPF300TLS-FCSG536I – PolarFire™ FPGA, 300,000 logic elements

The MPF300TLS-FCSG536I is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology. It integrates 300,000 logic elements and approximately 21.09 Mbits of embedded memory to support complex programmable logic functions within a compact 536-pin CSPBGA package.

Designed for industrial-grade deployments, this surface-mount FPGA provides a broad I/O count and a low-voltage core operating range for system designs that require high integration density and predictable thermal and electrical operating windows.

Key Features

  • Programmable Logic Capacity — 300,000 logic elements and 75,000 logic blocks provide substantial on-chip programmable resources for complex digital designs.
  • Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
  • I/O Count — 300 general-purpose I/O pins enable connectivity to sensors, peripherals, and high-pin-count interfaces.
  • Power and Voltage — Core supply range of 0.97 V to 1.08 V supports low-voltage system designs and predictable power budgeting.
  • Packaging and Mounting — 536-pin LFBGA / CSPBGA (supplier: 536-CSPBGA, 16×16) in a surface-mount package for space-constrained PCB layouts.
  • Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C for use in industrial environments.
  • Manufacturer — Produced by Microchip Technology, offering traceable sourcing and industry-standard manufacturing provenance.

Unique Advantages

  • High integration density: 300,000 logic elements and substantial embedded memory reduce the need for external logic and memory components, simplifying BOM and board area.
  • Ample I/O for interfacing: 300 I/Os provide flexible connectivity options to support complex multi-interface designs without external multiplexing.
  • Industrial-grade thermal range: Rated −40 °C to 100 °C to meet environmental requirements common in industrial applications.
  • Compact surface-mount package: 536-CSPBGA (16×16) enables high-density PCB implementations while maintaining a high pin count.
  • Low-voltage core operation: 0.97 V to 1.08 V core supply allows implementation in low-power architectures and facilitates power management planning.

Why Choose MPF300TLS-FCSG536I?

The MPF300TLS-FCSG536I positions itself as a high-capacity, industrial-grade FPGA option for designers requiring substantial programmable logic, embedded memory, and a high I/O count in a compact CSPBGA footprint. Its specified operating temperature range and surface-mount packaging make it suitable for industrial system designs that demand integration density and repeatable electrical characteristics.

Backed by Microchip Technology manufacturing, the device is suited for engineers and procurement teams looking for a scalable FPGA resource—combining large on-chip logic and memory with robust I/O and defined voltage and temperature operating windows to support medium- to high-complexity designs.

Request a quote or contact sales to discuss availability, pricing, and how the MPF300TLS-FCSG536I can fit into your next design.

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