MPF300TS-1FCG484I

The MPF300TS-1FCG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded applications. It provides a high-density programmable fabric with 300,000 logic elements and approximately 21.09 Mbits of on-chip RAM to support complex logic, buffering and state storage needs.

With 244 I/O pins, surface-mount 484-FCBGA packaging, a 0.97–1.08 V core supply range and an operating temperature range of −40 °C to 100 °C, this device targets industrial systems requiring substantial logic resources, significant embedded memory and rugged operating conditions.

Key Features

• Core Logic  Provides 300,000 logic elements to implement wide-ranging digital functions and parallel processing structures.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for frame buffering, state retention and intermediate data storage.
• I/O Capability  244 I/O pins to support diverse external interfaces and high pin-count connectivity requirements.
• Power Supply  Core voltage supply range of 0.970 V to 1.080 V to match system power design constraints.
• Package & Mounting  Surface-mount 484-BBGA / 484-FCBGA (23x23) package for compact board-level integration.
• Industrial Temperature Range  Specified operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use the device for programmable logic, control sequencing and real-time processing in industrial automation systems where an industrial temperature rating is required.
• Communications Infrastructure  Leverage abundant logic elements and on-chip memory for packet processing, protocol handling and interface glue logic in telecom and networking equipment.
• Instrumentation and Test Equipment  Implement custom signal processing, data aggregation and interface conversion functions with the FPGA’s logic density and I/O capacity.

Unique Advantages

• High logic density: 300,000 logic elements enable complex designs and significant parallelism without immediate need for multiple devices.
• Substantial on-chip memory: Approximately 21.09 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Robust I/O count: 244 I/O pins simplify integration with multiple peripherals and external subsystems.
• Industrial-grade temperature: Qualified for −40 °C to 100 °C operation, supporting deployment in harsh or temperature-variable environments.
• Compact surface-mount package: 484-FCBGA (23x23) footprint supports high-density PCB designs while providing ball-grid connectivity.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead-free production.

Why Choose MPF300TS-1FCG484I?

The MPF300TS-1FCG484I delivers a balanced combination of high logic capacity, ample embedded memory and extensive I/O in a surface-mount FCBGA package, tailored for industrial applications. Its voltage supply range and wide operating temperature window make it suitable for designs where reliability and environmental tolerance are important design criteria.

This FPGA is well suited for engineers building industrial control systems, communications gear or advanced instrumentation who need a single-device solution with significant on-chip resources and a compact board-level footprint. The device’s specifications support scalable designs and long-term deployment in demanding environments.

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