MPF300TS-1FCVG484I

The MPF300TS-1FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers a high-density fabric with 300,000 logic elements and approximately 21 Mbits of embedded memory to support complex digital designs requiring substantial logic and on-chip RAM.

With 284 user I/Os, a 484-ball FCBGA package, low core voltage range, and an industrial temperature rating, this device is suited for systems where integration, I/O capacity, and robust ambient operation are priorities.

Key Features

• Core Capacity — 300,000 logic elements provide substantial programmable logic resources for mid- to high-density designs.
• Logic Blocks — 75,000 logic blocks give a granular view of available logic resources for partitioning complex functions.
• Embedded Memory — Approximately 21 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 284 user I/Os to connect peripherals, sensors, and external interfaces directly to the FPGA fabric.
• Package — 484-ball FCBGA (484-BBGA, 19×19) surface-mount package for compact board integration.
• Power — Core supply range from 0.970 V to 1.08 V, enabling low-voltage operation consistent with modern system power architectures.
• Operating Temperature — Rated for industrial ambient conditions from −40 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Use the device's high logic capacity and industrial temperature rating to implement control algorithms, PLC functions, and real-time signal processing.
• Data Acquisition & Instrumentation — Leverage abundant I/O and on-chip RAM for high-channel-count sensor interfacing, buffering, and pre-processing.
• Communications Infrastructure — Deploy the FPGA for protocol bridging, packet processing, and custom interface logic where large logic and memory resources are required.

Unique Advantages

• High Logic Density: 300,000 logic elements enable integration of multiple functions into a single device, reducing board-level component count.
• Substantial Embedded Memory: Approximately 21 Mbits of on-chip RAM minimizes reliance on external memory for intermediate storage and low-latency buffering.
• Broad I/O Count: 284 user I/Os provide flexibility for connecting a wide range of peripherals and interfaces without external I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in demanding ambient conditions.
• Compact BGA Package: 484-FCBGA (19×19) offers a balance of pin count and board footprint for dense system designs.
• Low-Voltage Core: 0.970 V to 1.08 V core supply supports integration into modern power-constrained systems.

Why Choose MPF300TS-1FCVG484I?

The MPF300TS-1FCVG484I positions itself as a robust, high-capacity FPGA option for industrial-grade designs that demand substantial logic, on-chip memory, and flexible I/O. Its combination of 300,000 logic elements, approximately 21 Mbits of embedded RAM, and industrial temperature rating makes it suitable for complex control, data acquisition, and communications tasks.

Backed by Microchip Technology, this device offers designers a scalable platform to consolidate functions, reduce BOM complexity, and meet the thermal and I/O requirements of demanding systems.

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