MPF300TS-FC484M

The MPF300TS-FC484M is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides high logic capacity and embedded memory in a 484-BFCPGA package with through-hole mounting and a wide operating temperature range.

With 300,000 logic elements, approximately 21.6 Mbits of on-chip RAM and 284 user I/O, this device targets designs that require substantial programmable logic, significant embedded memory, and robust thermal performance.

Key Features

• Logic Capacity  300,000 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM to support data buffering, state storage and local memory requirements.
• I/O  284 available input/output pins to support multi-signal interfaces and wide connectivity needs.
• Power  Core voltage supply range of 970 mV to 1.08 V to match compatible system power rails.
• Package & Mounting  484-BFCPGA package (supplier device package: 484-CCGA, 23×23) with through-hole mounting for secure board attachment.
• Temperature & Grade  Military grade device rated for operation from −55 °C to 125 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic integration  Use the large logic capacity and embedded memory to implement complex programmable functions and multi-module integration on a single device.
• I/O‑intensive systems  Leverage 284 I/O pins for systems requiring many parallel interfaces or diverse signal routing.
• Rugged and temperature-sensitive electronics  Designed for environments demanding military-grade temperature performance from −55 °C to 125 °C.

Unique Advantages

• High logic density: 300,000 logic elements reduce the need for multiple devices when implementing large FPGA designs.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM supports local buffering and efficient data handling.
• Robust thermal and qualification profile: Military grade construction and a wide −55 °C to 125 °C operating range support demanding thermal environments.
• Extensive I/O capability: 284 I/O pins provide flexibility for interfacing with peripherals, sensors and other system components.
• Secure mounting option: Through-hole 484-BFCPGA package and 23×23 supplier package aid reliable board retention in mechanically challenging assemblies.
• Regulatory compliance: RoHS compliance supports environmentally conscious procurement and manufacturing processes.

Why Choose MPF300TS-FC484M?

The MPF300TS-FC484M combines high logic element count, substantial embedded memory and a large I/O complement in a military-grade FPGA package. Its specified core voltage range, through-hole 484-BFCPGA package, and extended temperature rating make it suitable for designs that demand durable, high-capacity programmable logic.

This part is well suited to engineering teams and procurement focused on long-term robustness, high integration and thermal resilience, providing a clear, specification-driven choice for complex FPGA implementations.

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