MPF300TS-FCG1152I

The MPF300TS-FCG1152I is a PolarFire™ FPGA IC tailored for industrial applications that require substantial programmable logic, on-chip memory and flexible I/O. As a surface-mount FCBGA device, it delivers a combination of large logic capacity, embedded memory and a broad operating temperature range suited to demanding environments.

Key Features

• Core Logic 300,000 logic elements provide extensive programmable logic resources for complex designs and custom hardware acceleration.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support buffering, state storage and data-intensive compute tasks.
• I/O Density 512 I/O pins enable high channel count interfacing for parallel data paths, control signals and external peripherals.
• Power Supply Operates from a core voltage range of 970 mV to 1.08 V, allowing integration into controlled power domains.
• Package & Mounting 1152-BBGA FCBGA package (1152-FCBGA, 35×35) in a surface-mount profile for high-density PCB integration.
• Temperature & Grade Industrial grade operation from −40 °C to 100 °C for deployment in industrial temperature environments.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for controlled materials.

Typical Applications

• Industrial Control — Implement complex control logic, protocol bridging and real-time signal processing in industrial automation equipment.
• Communications Infrastructure — Provide programmable datapath and protocol handling where high I/O density and embedded memory are required.
• High‑density I/O Systems — Support systems that require many parallel interfaces or mixed-signal front-end routing through programmable logic.

Unique Advantages

• Large Programmable Capacity: 300,000 logic elements enable implementation of sizeable custom logic blocks and accelerators without immediate need for external logic expansion.
• Significant On‑chip Memory: Approximately 21.09 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• High I/O Count: 512 I/O pins simplify integration with multiple peripherals and parallel data interfaces, minimizing external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet environmental demands typical of industrial deployments.
• Compact, High‑density Package: 1152-FCBGA (35×35) surface-mount package supports space-constrained PCB layouts while offering a robust pinout.
• Regulatory Compliance: RoHS compliant to support material and manufacturing requirements.

Why Choose MPF300TS-FCG1152I?

The MPF300TS-FCG1152I positions itself as a high-capacity, industrial-grade FPGA solution that balances extensive logic resources, substantial embedded memory and a high I/O count in a single FCBGA package. It is suited to designers needing programmable hardware for industrial control, communications infrastructure and other I/O‑intensive applications where operating temperature range and regulatory compliance matter.

With its combination of logic, memory and I/O density, the device offers scalable integration for mid- to large-size designs and supports long-term deployment in industrial environments where robustness and predictable power domains are required.

Request a quote or submit a procurement inquiry to receive pricing, availability and lead-time information for the MPF300TS-FCG1152I.