MPF300TS-FCG484I

The MPF300TS-FCG484I is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology designed for applications that require substantial programmable logic, embedded memory and a high count of I/O in an industrial-grade device. With 300,000 logic elements and approximately 21.09 Mbits of embedded memory, it targets systems needing mid-to-high density logic integration and on-chip RAM for buffering and stateful functions.

Delivered in a compact 484-FCBGA (23×23) surface-mount package and specified for industrial temperature operation, this device supports designs that demand reliable operation across a wide temperature range while offering a high pin count for system integration.

Key Features

• Core Logic Capacity  300,000 logic elements provide substantial programmable logic resources for complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, lookup tables and data storage close to logic for reduced external memory dependency.
• I/O Count  244 user I/O pins enable broad peripheral and interface connectivity for sensors, controllers and mezzanine modules.
• Power Supply  Core voltage range of 970 mV to 1.08 V supports low-voltage operation consistent with modern FPGA core requirements.
• Package and Mounting  484-FCBGA (23×23) package in a surface-mount form factor simplifies board integration while maintaining high I/O density.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial and harsh-environment applications.
• RoHS Compliance  RoHS-compliant manufacturing supports environmental and regulatory requirements.

Typical Applications

• Industrial Control & Automation  Use the device for programmable logic in PLCs, motion control and I/O aggregation where industrial temperature operation and high I/O count are required.
• Communications Infrastructure  Leverage the logic capacity and embedded memory for packet processing, protocol handling and control-plane functions in networking equipment.
• Embedded Systems & Data Acquisition  On-chip RAM and numerous I/O pins support real-time data buffering, sensor interfacing and custom preprocessing in embedded platforms.
• OEM & Module Integration  Compact FCBGA packaging and surface-mount mounting simplify integration into OEM modules and subsystem boards requiring dense logic and connectivity.

Unique Advantages

• High Logic Density: 300,000 logic elements enable consolidation of multiple functions into a single programmable device, reducing system complexity.
• Substantial On-Chip Memory: Approximately 21.09 Mbits of embedded RAM reduces reliance on external memory for many buffering and stateful tasks.
• Extensive I/O: 244 I/O pins provide flexible interfacing options to connect peripherals, sensors and external logic directly to the FPGA.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Low-Voltage Core Operation: Core supply range of 970 mV to 1.08 V aligns with efficient power domains and modern low-voltage architectures.
• Compact, High-Density Package: 484-FCBGA (23×23) surface-mount package balances board space efficiency with high pin count for system integration.

Why Choose MPF300TS-FCG484I?

The MPF300TS-FCG484I delivers a combination of substantial programmable logic, meaningful on-chip memory and broad I/O in an industrial-grade FPGA from Microchip Technology. It is well suited for designs that require consolidation of multiple digital functions, robust I/O connectivity and reliable operation across a wide temperature range.

For engineering teams and OEMs building industrial control, communications or embedded data-acquisition systems, this device offers a scalable platform that balances integration and operational robustness while simplifying board-level design with its compact 484-FCBGA surface-mount package.

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