MPF300TS-FCSG536I

The MPF300TS-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density programmable fabric with 300,000 logic elements and approximately 21 Mbits of embedded RAM for complex digital designs.

Designed for industrial environments, the device supports up to 300 I/Os, operates across a wide supply range of 970 mV to 1.08 V, and is rated for -40 °C to 100 °C operation in a 536-LFBGA / CSPBGA package suitable for surface-mount assembly.

Key Features

• Logic Resources — 300,000 logic elements to implement large-scale digital logic, custom processors, and complex state machines.
• Embedded Memory — Approximately 21 Mbits of on-chip RAM (21,094,400 bits) for buffering, look-up tables, and local storage.
• I/O Density — 300 user I/Os to support wide-ranging interface requirements and multiple peripheral connections.
• Power Supply — Operates from 970 mV to 1.08 V, enabling designs targeting low-voltage core domains.
• Package and Mounting — Available in a 536-LFBGA / 536-CSPBGA (16 × 16) package; surface-mount mounting type for compact PCB integration.
• Industrial Temperature Range — Rated for -40 °C to 100 °C to meet industrial ambient conditions.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control Systems — Leverage industrial-grade temperature rating and extensive I/O to interface sensors, actuators, and control networks in factory and process automation.
• High-Density Logic Implementation — Use the 300,000 logic elements and ~21 Mbits of embedded memory for custom compute, protocol processing, and parallel data paths.
• Communication and Interface Bridging — 300 I/Os enable complex interface consolidation and protocol translation on a single device.

Unique Advantages

• Large Programmable Fabric: 300,000 logic elements provide capacity for sizeable custom logic and multi-function designs, reducing the need for multiple devices.
• Substantial On-Chip Memory: Approximately 21 Mbits of embedded RAM supports buffering, packet handling, and local data storage without external memory.
• High I/O Count: 300 available I/Os simplify board-level routing and allow direct interfacing to numerous sensors, peripherals, and external devices.
• Industrial Reliability: Specified -40 °C to 100 °C operating range and industrial grade designation suit deployment in challenging environments.
• Compact Surface-Mount Package: 536-LFBGA / 536-CSPBGA (16×16) packaging enables dense PCB integration while supporting automated surface-mount assembly.
• Low-Voltage Core Operation: 970 mV to 1.08 V supply range supports designs optimized for low-power core domains.

Why Choose MPF300TS-FCSG536I?

The MPF300TS-FCSG536I balances high logic capacity, significant embedded memory, and substantial I/O in a single industrial-grade FPGA package from Microchip Technology. It is well suited for designs that require consolidated digital processing, extensive interfacing, and reliable operation across a wide temperature range.

For engineering teams targeting ruggedized or industrial applications where integration density and on-chip resources reduce board complexity, this device offers a compelling combination of capacity and package options to streamline system architecture and long-term deployment.

Request a quote for MPF300TS-FCSG536I or submit your specifications to receive pricing and availability information.