MPF300XT-1FCG1152I

The MPF300XT-1FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers a high logic-element capacity and on-chip memory in a compact 1152-ball FCBGA package for space-constrained, performance-oriented designs.

Typical use cases include compute- and I/O-intensive embedded systems that require sizable programmable logic, substantial embedded memory, and extended temperature operation for industrial environments.

Key Features

• Logic Capacity — Approximately 300,000 logic elements for implementing complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 21.09 Mbits of embedded memory for data buffering, FIFOs, and on-chip storage.
• I/O Resources — 512 user I/O pins to support broad peripheral and interface integration without external multiplexing.
• Power Supply — Core voltage supply range of 0.97 V to 1.08 V to match low-voltage system architectures.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C suitable for industrial environments; programming functions are supported over the industrial temperature range as described in the device documentation.
• Package & Mounting — 1152-ball FCBGA package (1152-FCBGA, 35×35 mm) in a surface-mount form factor for high-density PCB integration.
• Standards & Compliance — RoHS-compliant manufacturing.

Typical Applications

• Industrial Automation — Implement real-time control logic, motor-control interfaces, and deterministic I/O aggregation across 512 pins for factory and process automation.
• Communications Infrastructure — Use the device’s large logic capacity and on-chip memory for packet processing, protocol bridging, and data-path acceleration.
• Embedded Compute & Acceleration — Deploy custom hardware accelerators and data buffering in systems that need significant programmable fabric and memory onboard.
• Test & Measurement — Build flexible signal processing and multi-channel acquisition front ends leveraging abundant I/O and embedded memory.

Unique Advantages

• High Logic Density: Approximately 300,000 logic elements enable complex designs and multiple concurrent hardware functions on a single device.
• Substantial On-Chip Memory: Approximately 21.09 Mbits of embedded memory reduces dependence on external RAM for many buffering and storage needs.
• Broad I/O Integration: 512 I/O pins simplify direct connectivity to sensors, transceivers, and peripherals without excessive external logic.
• Industrial-Grade Operation: Specified operation from –40 °C to 100 °C aligns with industrial deployment and on-board programming within the industrial temperature range as documented.
• Compact, High-Density Package: 1152-FCBGA (35×35 mm) surface-mount package supports dense PCB layouts while maintaining robust connectivity.
• Regulatory Compliance: RoHS-compliant construction supports environmental and regulatory requirements.

Why Choose MPF300XT-1FCG1152I?

The MPF300XT-1FCG1152I balances substantial programmable logic, meaningful on-chip memory, and broad I/O in a compact FCBGA package tailored for industrial applications. Its voltage and temperature specifications make it suitable for designs that require low-voltage cores and extended operating ranges while maintaining high integration on a single FPGA device.

This part is well suited to engineering teams building complex embedded systems—where integration, maintainable BOM count, and industrial-temperature operation are primary considerations—and for projects that benefit from the PolarFire family’s documented electrical and programming characteristics.

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