MPF300TS-FCV484M

The MPF300TS-FCV484M is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology provided in a 484-BFBGA surface-mount package. It integrates 300,000 logic elements and approximately 21.6 Mbits of on-chip RAM with 284 user I/O, targeting designs that require substantial reconfigurable logic and dense I/O in a compact package.

This device operates from 0.970 V to 1.08 V and is specified for a military temperature range of −55 °C to 125 °C, making it suitable for applications that must tolerate wide thermal extremes while maintaining configurable hardware capability.

Key Features

• Logic Capacity  Provides 300,000 logic elements for implementing complex custom logic, state machines, and hardware accelerators.
• Embedded Memory  Includes approximately 21.6 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive logic functions.
• I/O Density  Offers 284 I/O pins to support multiple parallel interfaces, sensor connections, and external device control.
• Power  Core supply range from 0.970 V to 1.08 V to match system power-rail requirements and optimize power delivery.
• Package & Mounting  Delivered in a 484-BFBGA (484-FBGA, 19×19) package and designed for surface-mount assembly in space-constrained boards.
• Temperature & Grade  Specified for military grade operation with an operating temperature range of −55 °C to 125 °C for reliability in demanding thermal environments.
• Regulatory  RoHS compliant.

Typical Applications

• Custom hardware acceleration  Implement compute- or latency-sensitive functions using the device’s 300,000 logic elements and embedded memory.
• I/O-intensive systems  Leverage 284 I/O pins for parallel data acquisition, protocol bridging, or multi-channel interface tasks.
• High-reliability embedded platforms  Deploy in designs that require military-grade temperature performance from −55 °C to 125 °C.

Unique Advantages

• Scalable logic capacity: 300,000 logic elements enable substantial custom logic integration without multiple devices.
• Significant on-chip memory: Approximately 21.6 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup operations.
• High I/O count: 284 I/O pins provide flexibility for parallel interfaces, sensors, and peripheral connectivity.
• Military-grade thermal range: Specified operation from −55 °C to 125 °C supports deployment in thermally demanding environments.
• Compact BFBGA package: 484-BFBGA (19×19) format delivers a high-pin-count solution in a compact surface-mount footprint.
• Low-voltage core operation: 0.970 V to 1.08 V core supply range supports modern low-voltage system architectures.

Why Choose MPF300TS-FCV484M?

The MPF300TS-FCV484M combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 484-BFBGA package, offering a balanced platform for designs that require reconfigurable hardware and dense connectivity. Its military-grade temperature rating and defined low-voltage operation make it appropriate for systems where thermal resilience and tight power margins are key requirements.

Manufactured by Microchip Technology, this PolarFire FPGA is positioned for engineers and procurement teams seeking a robust, high-capacity programmable device for demanding embedded and I/O-rich applications.

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