MPF300TS-FCG784I

The MPF300TS-FCG784I is a PolarFire field programmable gate array (FPGA) IC offering a large logic fabric and substantial on-chip memory in a compact surface-mount FCBGA package. With 300,000 logic elements, approximately 21.09 Mbits of embedded memory and 388 I/O pins, it targets designs that require high logic capacity and significant I/O density within an industrial-grade device.

Designed for systems that operate across an extended temperature range and strict supply constraints, this FPGA provides integration and I/O availability suitable for industrial and other embedded applications that demand robustness and scalability.

Key Features

• Core Logic 300,000 logic elements provide a large programmable fabric for complex digital designs and custom logic implementation.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support buffering, state storage and memory-intensive logic functions.
• I/O Density 388 user I/O pins to accommodate wide parallel interfaces, sensor arrays, or high pin-count connectivity requirements.
• Power Supply Operates from a specified core voltage range of 0.97 V to 1.08 V, enabling predictable power design for the core domain.
• Package 784-FCBGA (29×29) surface-mount package (784-BBGA, FCBGA) for compact board integration and high pin count placement.
• Industrial Grade & Temperature Rated for industrial use with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• RoHS Compliant Device is RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• Industrial Control Systems Use the device’s industrial temperature rating and abundant I/O for control logic, sensor interfacing and deterministic system functions.
• I/O-Intensive Embedded Platforms Leverage 388 I/O pins to consolidate multiple parallel interfaces and reduce external glue logic on compact boards.
• Custom Logic and Acceleration Deploy the 300,000 logic elements and on-chip memory to implement application-specific processing, protocol handling, or state machines.

Unique Advantages

• Substantial Logic Capacity: 300,000 logic elements enable dense, feature-rich FPGA designs without partitioning across multiple devices.
• Embedded Memory for Data Handling: Approximately 21.09 Mbits of on-chip RAM supports buffering and local storage that simplify system memory architecture.
• High I/O Count: 388 I/O pins allow direct connection to numerous peripherals and parallel buses, reducing external components and routing complexity.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in harsh or temperature-variable environments.
• Compact BGA Package: The 784-FCBGA (29×29) package delivers high pin density in a surface-mount form factor suitable for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance supports environmental requirements for board-level manufacturing.

Why Choose MPF300TS-FCG784I?

The MPF300TS-FCG784I positions itself as a robust, high-capacity PolarFire FPGA option for designs that require extensive logic resources, ample embedded memory and a high count of user I/O in a single surface-mount package. Its industrial temperature rating and defined core supply range make it suitable for applications where environmental stability and predictable power design are important.

This FPGA is well suited to system designers and engineers building I/O-dense embedded platforms, complex control systems, or custom logic accelerators who need scalable logic capacity and on-chip memory in a compact form factor backed by PolarFire technology.

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