MPF300TS-FC784M

The MPF300TS-FC784M is a PolarFire™ FPGA packaged in a 784-FCBGA (29×29) surface-mount package, designed for applications requiring high logic capacity and extended temperature operation. This device provides 300,000 logic elements, approximately 21.6 Mbits of embedded memory, and 388 I/O pins, making it suitable for complex, feature-dense system designs.

With a core supply range of 970 mV to 1.08 V and a specified operating temperature range of −55 °C to 125 °C, the device targets applications that demand robust thermal performance and precise core-voltage operation.

Key Features

• Core Logic  300,000 logic elements and 75,000 CLBs provide large-scale programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 21.6 Mbits of on-chip RAM for buffering, packet processing, and data-path storage.
• I/O Density  388 I/O pins enable extensive interface connectivity for multi-channel systems and high-pin-count peripherals.
• Power  Core supply voltage range of 970 mV to 1.08 V to match precise core-voltage requirements in power-sensitive designs.
• Package and Mounting  784-BBGA / 784-FCBGA (29×29) surface-mount package for high-density PCB integration.
• Temperature and Grade  Rated for operation from −55 °C to 125 °C and specified as Military grade for demanding thermal and environmental conditions.
• RoHS Compliance  Meets RoHS environmental requirements for lead-free manufacturing processes.

Typical Applications

• Communications Infrastructure  High logic capacity and abundant I/O support packet processing, protocol bridging, and line-card functions.
• Defense and Military Systems  Military grade and wide operating temperature range enable deployment in rugged, high-reliability environments.
• High-Density Data Processing  Large embedded RAM and extensive logic resources support buffering, acceleration, and custom data-path implementations.

Unique Advantages

• High Logic Capacity: 300,000 logic elements and 75,000 CLBs provide headroom for complex algorithms and multi-function designs.
• Substantial On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces dependence on external memory for many data-intensive tasks.
• Extensive I/O Count: 388 I/O pins allow flexible interfacing with multiple peripherals and high-density connector schemes.
• Wide Thermal Range: −55 °C to 125 °C operating range supports deployment in temperature-challenging installations.
• Compact, High-Density Package: 784-FCBGA (29×29) surface-mount package simplifies board-level integration in space-constrained layouts.
• RoHS Compliant: Compatible with lead-free manufacturing and environmental compliance requirements.

Why Choose MPF300TS-FC784M?

The MPF300TS-FC784M positions itself as a high-capacity, rugged FPGA option for designs that require substantial programmable logic, sizable on-chip memory, and a large I/O complement within a compact FCBGA package. Its specified core voltage range and wide operating temperature window make it suitable for electrically precise and thermally demanding applications.

This device is ideal for engineers building complex communications, defense, or high-density data-processing systems that need scalable logic resources, sizable embedded RAM, and reliable operation across extreme temperatures, while adhering to RoHS requirements.

Request a quote or submit an RFQ for MPF300TS-FC784M to begin your procurement or design evaluation process.