MPF300TS-1FCSG536I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 300 21094400 300000 536-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,460 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 536-CSPBGA (16x16) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 536-LFBGA, CSPBGA | Number of I/O | 300 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21094400 |
Overview of MPF300TS-1FCSG536I – PolarFire FPGA, 300,000 Logic Elements, 536-LFBGA
The MPF300TS-1FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC that delivers 300,000 logic elements and approximately 21.1 Mbits of embedded memory in a compact 536-LFBGA surface-mount package. The device provides 75,000 CLBs and 300 user I/Os to support complex programmable logic and interfacing requirements.
Specified as industrial grade, the device operates from a core supply range of 970 mV to 1.08 V and across an operating temperature range of −40 °C to 100 °C. The MPF300TS-1FCSG536I is RoHS compliant for environmental conformity.
Key Features
- High-density programmable logic 300,000 logic elements and 75,000 CLBs for implementing complex logic, datapaths, and custom accelerators.
- Embedded memory Approximately 21.1 Mbits of on-chip RAM for buffering, state storage, and data processing.
- I/O resources 300 user I/Os to support multiple external interfaces and peripheral connections.
- Low-voltage core Core supply range from 970 mV to 1.08 V to support low-voltage system architectures.
- Package and mounting 536-LFBGA (536-CSPBGA, 16x16) surface-mount package for compact PCB integration.
- Industrial temperature and grade Rated for operation from −40 °C to 100 °C and specified as industrial grade.
- Environmental compliance RoHS compliant.
Unique Advantages
- High logic capacity: 300,000 logic elements enable large-scale, high-complexity designs without external programmable logic expansion.
- Significant on-chip RAM: Approximately 21.1 Mbits of embedded memory reduces reliance on external memory for many buffering and state-storage needs.
- Ample I/O count: 300 I/Os provide flexibility for multiple peripherals, sensors, and interface standards within a single device.
- Compact surface-mount package: 536-LFBGA (536-CSPBGA, 16x16) supports dense PCB layouts while maintaining robust soldered mounting.
- Industrial-rated operation: −40 °C to 100 °C operating range and industrial grade specification for deployment in thermally demanding environments.
Why Choose MPF300TS-1FCSG536I?
The MPF300TS-1FCSG536I combines high logic density, substantial on-chip memory, and a 300-pin I/O complement in a compact 536-LFBGA package, making it well suited for designs that require significant programmable logic capacity and robust environmental performance. Its industrial temperature rating and RoHS compliance provide specification-driven confidence for deployment in industrial and temperature-challenging applications.
This device is a fit for engineers and procurement teams seeking a high-density FPGA solution that balances logic resources, embedded memory, I/O connectivity, and compact packaging while adhering to industrial temperature and environmental requirements.
Request a quote or submit an inquiry to obtain pricing and availability for the MPF300TS-1FCSG536I.
Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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