MPF300TS-1FCG1152I

The MPF300TS-1FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC provided in a 1152-FCBGA (35 × 35) package. It delivers a large on-chip logic capacity and embedded memory suitable for industrial designs that require reconfigurable logic, high I/O density and extended temperature operation.

Key architectural attributes include approximately 300,000 logic elements, roughly 21.09 Mbits of embedded memory, and 512 user I/O pins, combined with a low-voltage core supply and RoHS compliance for modern assembly processes.

Key Features

• Core Logic  Approximately 300,000 logic elements powered by about 75,000 CLBs, providing large-scale reconfigurable logic capacity for complex designs.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support frame buffers, packet buffers, and other data-intensive functions without immediate external memory.
• I/O Density  512 user I/O pins suitable for high-density interfacing to peripherals, sensors, and external devices.
• Package  1152-FCBGA (35 × 35) surface-mount package for compact, high-pin-count board implementations.
• Power  Core supply range from 0.970 V to 1.080 V to match low-voltage system architectures and power domains.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, enabling deployment in a wide range of environmental conditions.
• Compliance  RoHS-compliant component suitable for lead-free manufacturing and assembly flows.

Typical Applications

• Industrial control and automation  Suitable where reconfigurable logic, robust I/O and extended temperature range are required for automation and machine control systems.
• High-density I/O systems  Ideal for applications that need large numbers of external interfaces, signal aggregation, or protocol bridging using the 512 available I/Os.
• Embedded data buffering and processing  On-chip memory capacity supports buffering and intermediate data processing without immediate reliance on external memory.

Unique Advantages

• High logic capacity: Approximately 300,000 logic elements enable implementation of complex custom logic and parallel processing pipelines.
• Substantial on-chip memory: Roughly 21.09 Mbits of embedded RAM reduces dependency on external memory for many buffering and temporary storage needs.
• Large I/O count: 512 user I/Os simplify system integration by supporting many direct peripheral connections and high channel counts.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environments.
• Compact high-pin-count package: The 1152-FCBGA (35 × 35) package integrates a high pin count in a compact footprint for board-space-constrained designs.
• RoHS compliant: Supports lead-free manufacturing and aligns with modern assembly standards.

Why Choose MPF300TS-1FCG1152I?

The MPF300TS-1FCG1152I positions itself as a high-capacity, industrial-grade FPGA option combining significant logic resources, substantial embedded memory and a high I/O count in a compact FCBGA package. Its operating range and RoHS compliance make it suitable for engineered systems that require both reconfigurability and reliable operation across extended temperatures.

This part is well suited for engineering teams building scalable, reconfigurable solutions that demand large local memory, dense I/O connectivity and sustained operation in industrial environments. The combination of logic, memory and package density supports long-term design scalability and integration into complex system architectures.

Request a quote or submit an inquiry to receive pricing and availability for the MPF300TS-1FCG1152I and to discuss how it can fit into your next design.