MPF300TS-1FCG784NI

The MPF300TS-1FCG784NI is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology, packaged in a 784-ball FCBGA (29 × 29) surface-mount package. With 300,000 logic elements, 388 I/Os and approximately 21.6 Mbits of embedded memory, it targets designs that require substantial programmable logic capacity and I/O density within an industrial temperature range.

Its specified operating conditions include a core voltage supply range of 0.97 V to 1.08 V and an operating temperature range of –40 °C to 100 °C, making it suitable for industrial environments where extended temperature tolerance and high integration are required.

Key Features

• Logic Capacity 300,000 logic elements provide significant programmable logic resources for complex digital functions.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density 388 I/Os enable broad connectivity for high-pin-count interfaces, sensor arrays, and multi-channel systems.
• Power Supply Core voltage specified from 0.97 V to 1.08 V, enabling integration with low-voltage system designs.
• Package and Mounting 784-FCBGA (29 × 29) package in a surface-mount format for compact, high-density PCB implementations.
• Industrial Temperature and Grade Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems — Implement custom control logic and I/O aggregation using the 300,000 logic elements and 388 I/Os for machinery control, PLC augmentation, and I/O-intensive automation tasks.
• Communications Infrastructure — Use the device's logic capacity and embedded memory to implement protocol processing, interface bridging and high-density port handling in network equipment.
• Imaging and Vision Processing — Support multi-channel sensor interfaces and local processing pipelines where significant logic resources and on-chip RAM are needed for buffering and algorithm implementation.
• Test and Measurement Equipment — Enable flexible, reconfigurable digital front-ends and data capture systems that benefit from high I/O counts and substantial programmable logic.

Unique Advantages

• High Logic Integration: 300,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level complexity and component count.
• Substantial On-Chip Memory: Approximately 21.6 Mbits of RAM supports local storage for buffering, lookup tables and state machines, reducing external memory needs.
• Extensive I/O Connectivity: 388 I/Os provide the pin count required for high-channel systems, simplifying interface routing and integration.
• Industrial Thermal Range: Rated for –40 °C to 100 °C operation, enabling deployment where extended temperature tolerance is required.
• Compact High-Density Package: 784-ball FCBGA (29 × 29) surface-mount package supports high-density PCB designs while delivering the device’s full feature set.
• RoHS Compliant: Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose MPF300TS-1FCG784NI?

The MPF300TS-1FCG784NI positions itself as a high-capacity, industrial-grade PolarFire FPGA option for designs that demand a large number of logic elements, extensive I/O, and meaningful on-chip memory in a compact FCBGA package. Its voltage and temperature specifications make it suitable for systems that require reliable operation across a broad environment range.

Design teams building industrial control, communications, imaging, or test equipment can leverage this device to consolidate functionality, reduce external components, and scale logic-intensive designs while benefiting from Microchip Technology’s PolarFire FPGA family.

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