MPF300TS-1FCG784I

The MPF300TS-1FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 784-FCBGA (29 × 29) package. It integrates 300,000 logic elements with approximately 21.09 Mbits of embedded memory and 388 user I/O pins, providing a high-density programmable fabric for complex digital designs.

Designed for industrial-grade environments, the device supports surface-mount assembly and operates over a −40 °C to 100 °C temperature range with a core voltage supply from 0.97 V to 1.08 V, enabling deployment in temperature-sensitive and power-conscious systems.

Key Features

• Core Logic — 300,000 logic elements for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 21.09 Mbits of on-chip RAM (21,094,400 bits) to support data buffering, state machines, and memory-intensive algorithms.
• I/O Density — 388 user I/O pins to accommodate a wide range of external interfaces and high pin-count designs.
• Power — Core voltage supply range from 0.97 V to 1.08 V for defined power-domain design and system-level power planning.
• Package & Mounting — 784-FCBGA (29 × 29) package in a 784-BBGA/FCBGA form factor, optimized for surface-mount PCB assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial application thermal requirements.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Unique Advantages

• High Logic Capacity: 300,000 logic elements provide substantial programmable resources for integrating multiple functions on a single device, reducing board-level complexity.
• Significant On‑Chip Memory: Approximately 21.09 Mbits of embedded RAM supports large buffers and local memory needs without external memory.
• Robust I/O Count: 388 I/Os allow flexible interfacing to sensors, peripherals, and high-pin-count connectors without immediate external expansion.
• Industrial-Grade Thermal Margin: −40 °C to 100 °C operating range helps ensure reliable operation in demanding environments.
• Compact, Surface-Mount Package: 784-FCBGA (29 × 29) packaging balances high density with PCB assembly compatibility for compact system designs.
• Manufacturer Backing: Produced by Microchip Technology, providing access to device documentation and support resources.

Why Choose MPF300TS-1FCG784I?

The MPF300TS-1FCG784I combines a large logic fabric, substantial on-chip memory, and high I/O count in a single industrial-grade FPGA package, enabling designers to consolidate functions and reduce system BOM. Its defined core voltage range and industrial temperature rating make it suitable for power-conscious designs requiring reliable operation across a wide thermal envelope.

Ideal for development teams and procurement seeking a high-density programmable device from a recognized manufacturer, this PolarFire™ FPGA offers scalability and integration that support long-term system designs and disciplined production deployment.

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