MPF300TS-FCG784NI

The MPF300TS-FCG784NI is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering high logic density and significant embedded memory capacity for industrial-grade designs. Its architecture delivers a combination of 300,000 logic elements, approximately 21.6 Mbits of embedded memory, and 388 I/O lines to support complex digital processing and high‑pin-count system integration.

Designed for surface-mount assembly in a 784-FCBGA package, this device targets industrial applications that require broad temperature range operation and low-voltage core supply compatibility.

Key Features

• Core Logic 300,000 logic elements provide substantial programmable fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory Approximately 21.6 Mbits of on-chip RAM to support buffering, state storage, and data-path requirements without relying solely on external memory.
• I/O Capability 388 I/O pins enable connections to a wide range of peripherals, sensors, and high-density interconnects for system-level flexibility.
• Power Core voltage supply range from 970 mV to 1.08 V for compatibility with low-voltage power domains.
• Package & Mounting Supplied in a 784-FCBGA (29×29) / 784-BBGA FCBGA package and specified for surface-mount assembly to accommodate dense board layouts.
• Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C, suitable for deployed systems with extended temperature requirements.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation Implement real-time control logic, machinery interfaces, and deterministic processing where industrial temperature range and extensive I/O are required.
• Communications & Networking Use the FPGA’s logic density and embedded memory for protocol processing, packet handling, and custom interface bridging in communication equipment.
• Data Acquisition & Processing Deploy as a data-path accelerator for sensor aggregation, preprocessing, and buffering using the on-chip RAM and abundant I/O.

Unique Advantages

• High Logic Capacity: 300,000 logic elements enable large-scale designs and implementation of complex algorithms on a single device.
• Significant On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces reliance on external memory for many applications, simplifying board design.
• Extensive I/O Count: 388 I/Os provide flexible connectivity for dense systems and multi‑interface designs.
• Industrial Temperature Rating: Operation from -40 °C to 100 °C supports deployments in rugged and temperature-variable environments.
• Compact FCBGA Package: 784-FCBGA (29×29) package supports high-density PCB layouts while enabling surface-mount assembly.
• RoHS Compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose MPF300TS-FCG784NI?

The MPF300TS-FCG784NI positions itself as a capable industrial-grade FPGA delivering a balance of logic capacity, embedded memory, and high I/O count for demanding system designs. Its low-voltage core compatibility and wide operating temperature range make it suitable for applications that need robust, scalable programmable logic in harsh environments.

This device is well suited to designers and integrators building industrial control, communications, or data acquisition systems who require a single-chip programmable solution that reduces external component count and supports complex, high-density implementations.

Request a quote or submit an inquiry to obtain pricing, availability, and support for integrating the MPF300TS-FCG784NI into your next design.