MPF300TS-FCS536M

The MPF300TS-FCS536M is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers high logic capacity and on-chip memory in a compact, surface-mount 536-LFBGA package.

With 300,000 logic elements, approximately 21.6 Mbits of embedded memory, 300 I/Os, a supply range of 0.97 V to 1.08 V, and military-grade operation from −55 °C to 125 °C, this device targets applications that require dense logic, significant local memory, and wide temperature tolerance.

Key Features

• Core Logic Density  Provides 300,000 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory  Includes approximately 21.6 Mbits of on-chip RAM for buffering, state storage, and data path processing.
• I/O Resources  Features 300 I/O pins to support high pin-count interfaces and reduce the need for external multiplexing.
• Power Supply  Operates from a core supply range of 0.97 V to 1.08 V for integration with low-voltage system rails.
• Package & Mounting  Supplied in a 536-LFBGA (536-BGA, 16 × 16) surface-mount package for dense board-level integration.
• Temperature & Grade  Military grade device rated for operation from −55 °C to 125 °C for demanding environmental conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Military and Defense Systems  Military-grade temperature rating supports deployment in defense electronics and rugged platforms.
• High-Density I/O Systems  Large I/O count enables dense interfacing for data aggregation, protocol bridging, and multi-port designs.
• Memory-Intensive FPGA Tasks  Approximately 21.6 Mbits of embedded memory supports buffering, packet processing, and local storage for streaming data paths.
• Custom Logic and Acceleration  300,000 logic elements provide capacity for custom hardware blocks and application-specific acceleration.

Unique Advantages

• High Logic Capacity: 300,000 logic elements allow implementation of large, complex designs without extensive external logic.
• Substantial On-Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces external memory dependencies and latency.
• Extensive I/O: 300 I/Os enable direct interfacing to multiple peripherals and high-bandwidth connections, simplifying board design.
• Wide Temperature Range and Military Grade: Rated from −55 °C to 125 °C for reliable operation in harsh environments.
• Compact, High-Density Package: 536-LFBGA (16 × 16) surface-mount package supports space-constrained, high-performance boards.
• RoHS Compliant: Meets environmental regulatory requirements for reduced hazardous substances.

Why Choose MPF300TS-FCS536M?

The MPF300TS-FCS536M combines substantial logic capacity, significant embedded memory, and a high I/O count in a military-grade, surface-mount 536-LFBGA package. It is well suited for designs that require dense on-chip resources and reliable operation across a wide temperature range.

Backed by Microchip Technology, this PolarFire FPGA variant is a practical choice for engineers and procurement teams targeting demanding embedded applications that need scalable logic, local memory, and robust environmental performance.

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