MPF300TS-FCVG484I
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 21094400 300000 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,231 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21094400 |
Overview of MPF300TS-FCVG484I – PolarFire™ FPGA, 300,000 logic elements, 484-FCBGA
The MPF300TS-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering high logic density and on-chip memory in a compact ball-grid array package. It provides up to 300,000 logic elements, approximately 21.09 Mbits of embedded memory and 284 I/O to support feature-rich, space-constrained designs.
Specified for industrial use, the device is RoHS compliant and operates across a wide temperature range, with a low-voltage core supply that supports power-efficient implementations.
Key Features
- Logic Density — 300,000 logic elements for substantial on-chip logic capacity and complex implementation potential.
- Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
- I/O — 284 I/O pins to accommodate multiple interfaces and external peripherals.
- Power — Core voltage supply range of 970 mV to 1.08 V for low-voltage operation and power-sensitive designs.
- Package & Mounting — 484-FCBGA (19×19) / 484-BBGA in a surface-mount FCBGA package for high-density board integration.
- Industrial Grade & Temperature — Rated operating temperature from -40 °C to 100 °C for use in industrial environments.
- Compliance — RoHS compliant.
Unique Advantages
- High integration density: 300,000 logic elements combined with substantial embedded memory reduces the need for external logic and memory devices.
- Robust industrial operation: Specified -40 °C to 100 °C operation supports deployment in industrial temperature environments.
- Compact, high-pin-count package: 484-FCBGA packaging provides a balance between high I/O count and minimized board area.
- Power-aware core voltage: Narrow supply range (970 mV–1.08 V) supports low-voltage system designs.
- Design flexibility: 284 I/O and significant on-chip RAM enable diverse peripheral connectivity and local data handling without immediate external components.
- Regulatory readiness: RoHS compliance simplifies integration into markets with hazardous-substance restrictions.
Why Choose MPF300TS-FCVG484I?
MPF300TS-FCVG484I positions itself as a high-density, industrial-grade PolarFire™ FPGA option for designs that require substantial on-chip logic and memory in a compact FCBGA footprint. Its combination of 300,000 logic elements, approximately 21.09 Mbits of embedded RAM, and 284 I/O makes it suitable for engineers seeking a balance of capacity, I/O flexibility, and board-level integration.
The device’s industrial temperature rating, RoHS compliance, and surface-mount 484-FCBGA packaging deliver long-term robustness and manufacturability for production environments where reliability and regulatory conformance matter.
Request a quote or submit an inquiry to get pricing and availability for MPF300TS-FCVG484I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D