MPF300TS-FCVG484I

IC FPGA 284 I/O 484FCBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 284 21094400 300000 484-BBGA, FCBGA

Quantity 1,231 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O284Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs75000Number of Logic Elements/Cells300000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits21094400

Overview of MPF300TS-FCVG484I – PolarFire™ FPGA, 300,000 logic elements, 484-FCBGA

The MPF300TS-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC offering high logic density and on-chip memory in a compact ball-grid array package. It provides up to 300,000 logic elements, approximately 21.09 Mbits of embedded memory and 284 I/O to support feature-rich, space-constrained designs.

Specified for industrial use, the device is RoHS compliant and operates across a wide temperature range, with a low-voltage core supply that supports power-efficient implementations.

Key Features

  • Logic Density — 300,000 logic elements for substantial on-chip logic capacity and complex implementation potential.
  • Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support buffering, packet handling, and local data storage.
  • I/O — 284 I/O pins to accommodate multiple interfaces and external peripherals.
  • Power — Core voltage supply range of 970 mV to 1.08 V for low-voltage operation and power-sensitive designs.
  • Package & Mounting — 484-FCBGA (19×19) / 484-BBGA in a surface-mount FCBGA package for high-density board integration.
  • Industrial Grade & Temperature — Rated operating temperature from -40 °C to 100 °C for use in industrial environments.
  • Compliance — RoHS compliant.

Unique Advantages

  • High integration density: 300,000 logic elements combined with substantial embedded memory reduces the need for external logic and memory devices.
  • Robust industrial operation: Specified -40 °C to 100 °C operation supports deployment in industrial temperature environments.
  • Compact, high-pin-count package: 484-FCBGA packaging provides a balance between high I/O count and minimized board area.
  • Power-aware core voltage: Narrow supply range (970 mV–1.08 V) supports low-voltage system designs.
  • Design flexibility: 284 I/O and significant on-chip RAM enable diverse peripheral connectivity and local data handling without immediate external components.
  • Regulatory readiness: RoHS compliance simplifies integration into markets with hazardous-substance restrictions.

Why Choose MPF300TS-FCVG484I?

MPF300TS-FCVG484I positions itself as a high-density, industrial-grade PolarFire™ FPGA option for designs that require substantial on-chip logic and memory in a compact FCBGA footprint. Its combination of 300,000 logic elements, approximately 21.09 Mbits of embedded RAM, and 284 I/O makes it suitable for engineers seeking a balance of capacity, I/O flexibility, and board-level integration.

The device’s industrial temperature rating, RoHS compliance, and surface-mount 484-FCBGA packaging deliver long-term robustness and manufacturability for production environments where reliability and regulatory conformance matter.

Request a quote or submit an inquiry to get pricing and availability for MPF300TS-FCVG484I.

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