MPF500T-1FCG1152I

The MPF500T-1FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It provides a large programmable fabric with 481,000 logic elements, substantial embedded memory, and high I/O density in a 1152-FCBGA package for surface-mount assembly.

This device addresses designs that require a combination of high logic capacity, abundant I/O, and extended operating temperature capability, while operating from a core supply range of 970 mV to 1.08 V.

Key Features

• Logic Capacity 481,000 logic elements that enable complex, high-density programmable designs.
• Embedded Memory Approximately 33.8 Mbits of on-chip RAM to support large buffers, state machines, and data processing functions.
• I/O Density 584 I/O pins to support extensive interfacing and parallel connectivity requirements.
• Power & Voltage Operates from a core voltage supply range of 970 mV to 1.08 V for the FPGA core domain.
• Package & Mounting 1152-ball FCBGA (35 × 35 mm) package, surface mount, suitable for compact, board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial automation and control — Use the device's large logic capacity and industrial temperature rating for configurable control, signal processing, and I/O aggregation.
• High-density I/O systems — Leverage 584 I/O pins and the FCBGA package for systems that require extensive external interfacing or parallel data paths.
• Embedded processing platforms — Utilize approximately 33.8 Mbits of embedded memory together with large logic resources for custom data buffering and processing tasks.
• Ruggedized electronics — The −40 °C to 100 °C operating range and industrial grade make this FPGA suitable for applications with extended temperature requirements.

Unique Advantages

• High logic integration: 481,000 logic elements provide the capacity to implement complex state machines, custom datapaths, and large-scale combinational/sequential logic on a single device.
• Substantial on-chip memory: Approximately 33.8 Mbits of embedded RAM reduce the need for external memory for many buffering and caching use cases.
• Extensive I/O: 584 I/O pins enable broad connectivity without additional interface chips, simplifying board-level design.
• Industrial-grade operation: Rated for −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Compact, manufacturable package: 1152-FCBGA (35 × 35 mm) surface-mount package supports dense PCB layouts and standard assembly processes.
• Controlled core voltage: Core operation within 970 mV to 1.08 V enables integration into designs with defined power domains.

Why Choose MPF500T-1FCG1152I?

The MPF500T-1FCG1152I combines a large programmable fabric, significant embedded memory, and high I/O count in a single industrial-grade FPGA package. Its operating temperature range and surface-mount 1152-FCBGA footprint make it suitable for designs that demand both capacity and durability.

Backed by Microchip Technology, this PolarFire™ FPGA offers a balance of integration and environmental tolerance that fits complex industrial systems and other applications requiring substantial on-chip resources and robust operating margins.

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