MPF500T-FCG1152I

The MPF500T-FCG1152I is a PolarFire™ field programmable gate array (FPGA) IC designed for systems that require large programmable logic capacity and high I/O density. It integrates 481,000 logic elements and approximately 33.8 Mbits of embedded memory with 584 general-purpose I/O pins in a 1152-FCBGA package.

Manufactured for industrial-grade operation, this device supports a supply voltage range of 970 mV to 1.08 V and an operating temperature range of −40 °C to 100 °C, making it suitable for deployment in temperature-demanding environments.

Key Features

• Logic Capacity — 481,000 logic elements provide substantial programmable fabric for complex digital designs and high-density logic integration.
• Embedded Memory — Approximately 33.8 Mbits of on-chip RAM to support buffering, data storage, and intermediate processing without external memory dependency.
• I/O Density — 584 I/O pins to accommodate multi-channel interfaces, parallel buses, and high-pin-count system connectivity.
• Package — 1152-BBGA (1152-FCBGA, 35×35) surface-mount package for compact board-level integration and standardized assembly.
• Power — Core supply range from 970 mV to 1.08 V to match system power-rail design and regulator choices.
• Industrial Temperature Range — Qualified for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control — Use the device’s large logic capacity and industrial temperature rating for control algorithms, automation, and motor-control interfaces.
• High-Density I/O Systems — Leverage 584 I/O pins for multi-channel data acquisition, sensor aggregation, and parallel interface implementations.
• Embedded Processing — Employ the substantial embedded memory and logic elements for custom data-paths, protocol offload, and system glue logic.

Unique Advantages

• Substantial Logic Resources: 481,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Generous On-Chip Memory: Approximately 33.8 Mbits of embedded RAM supports high-throughput buffering and local storage, minimizing external memory needs.
• High I/O Count: 584 accessible I/O pins provide flexibility for dense interface requirements and multiple parallel connections.
• Industrial-Grade Operation: Rated for −40 °C to 100 °C to meet environmental demands of industrial deployments.
• Compact FCBGA Package: 1152-FCBGA (35×35) footprint balances pin count and board area for compact system designs.
• Controlled Supply Range: Core voltage support from 970 mV to 1.08 V allows predictable power integration with system regulators.

Why Choose MPF500T-FCG1152I?

The MPF500T-FCG1152I positions itself as a high-capacity, industrial-grade FPGA solution that combines extensive logic resources, sizeable embedded memory, and a high I/O count in a compact FCBGA package. Its specified voltage and temperature ranges make it appropriate for designs that require predictable electrical integration and robust thermal performance.

This part is suited for engineers and procurement teams developing systems that need to consolidate complex logic functions, support numerous external interfaces, and operate reliably across wide temperature ranges. The device’s combination of logic, memory, and I/O on a single package supports long-term design scalability and system-level integration.

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