MPF500T-FCG784E

The MPF500T-FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high logic capacity fabric with substantial embedded memory and a large I/O count in a 784-ball FCBGA package for surface-mount assembly.

Designed for applications that require dense programmable logic, significant on-chip RAM, and a wide I/O footprint, the device combines core voltage efficiency and a defined operating temperature range to support robust board-level integration.

Key Features

• Logic Capacity 481,000 logic elements provide substantial programmable resources for complex custom logic and algorithm implementation.
• Embedded Memory Approximately 33.8 Mbits of on-chip RAM to support buffering, data storage, and logic-intensive tasks without external memory dependency.
• I/O 388 user I/O pins to accommodate wide peripheral interfacing and high-density signal routing on the board.
• Power Supply Core supply range of 0.970 V to 1.08 V, enabling operation within a narrow, defined core-voltage window.
• Package & Mounting 784-ball FCBGA (784-FCBGA, 29 × 29) package in a surface-mount form factor for compact PCB implementation and reliable solder attachment.
• Operating Temperature & Grade Rated for operation from 0 °C to 100 °C and supplied in Extended grade to match specified thermal requirements.
• Environmental Compliance RoHS compliant to meet common environmental material restrictions.

Typical Applications

• Custom Logic Acceleration Implement high-density custom datapaths and control logic using 481,000 logic elements and significant embedded memory to reduce external components.
• High-Density I/O Systems Support a large number of digital interfaces and signal channels with 388 available I/O pins for complex board-level connectivity.
• On-Chip Data Buffering Use approximately 33.8 Mbits of embedded RAM for temporary storage, packet buffering, and memory-intensive processing close to the logic fabric.

Unique Advantages

• High Logic Integration: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing BOM and board area.
• Substantial Embedded Memory: Approximately 33.8 Mbits of on-chip RAM lowers reliance on external memory and simplifies memory architecture.
• Extensive I/O: 388 I/O pins provide flexibility for interfacing to a wide variety of peripherals and high-pin-count designs.
• Compact, Surface-Mount Package: 784-ball FCBGA (29 × 29) packaging supports dense PCB layouts while maintaining reliable solder connections.
• Controlled Power Range: Defined core voltage range (0.970 V–1.08 V) supports predictable power design and voltage regulation choices.
• Compliance and Thermal Range: RoHS compliance and an operating range of 0 °C–100 °C provide clear environmental and thermal parameters for system integration.

Why Choose MPF500T-FCG784E?

The MPF500T-FCG784E positions itself as a high-capacity PolarFire FPGA option for designers who need substantial programmable logic, on-chip memory, and broad I/O in a single package. Its combination of 481,000 logic elements, approximately 33.8 Mbits of embedded RAM, and 388 I/O pins supports consolidation of complex functions and streamlined board designs.

With a surface-mount 784-ball FCBGA package, defined core voltage range, and an operating temperature of 0 °C to 100 °C, the device provides predictable integration parameters and environmental compliance for procurement and system design. It is suited for teams looking to leverage Microchip Technology's PolarFire FPGA resources where dense logic, memory, and I/O are priorities.

Request a quote or submit an inquiry to obtain pricing and availability for the MPF500T-FCG784E and discuss how it fits your design requirements.