MPF500T-FCG1152E

The MPF500T-FCG1152E is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology. It provides a large logic fabric and on-chip memory in a 1152-ball FCBGA package for surface-mount assembly.

With 481,000 logic elements, approximately 33.8 Mbits of embedded memory and 584 I/Os, this device addresses designs that require substantial programmable logic, memory resources and a high I/O count while operating on a low-voltage core supply.

Key Features

• Logic Capacity 481,000 logic elements for complex digital designs and high-density logic integration.
• Embedded Memory Approximately 33.8 Mbits of on-chip RAM (33,792,000 bits) to support data buffering, FIFOs and state storage.
• I/O Count 584 programmable I/Os to accommodate wide parallel interfaces and multiple peripheral connections.
• Power Core supply range 0.970 V to 1.080 V, enabling compatibility with low-voltage FPGA power domains.
• Package & Mounting 1152-BBGA, FCBGA footprint; supplier device package listed as 1152-FCBGA (35×35). Surface-mount mounting type for PCB assembly.
• Operating Range Grade: Extended with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High‑density digital processing — Use the device’s large logic element count and embedded memory for complex state machines, packet processing or custom accelerators.
• Multi‑port interfacing — 584 I/Os support designs that require numerous parallel and serial interfaces or large pin-count daughtercard connections.
• Memory‑intensive buffering — Approximately 33.8 Mbits of on-chip RAM enable sizable data buffering, queuing and packet staging within the FPGA fabric.

Unique Advantages

• High logic density: 481,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing BOM complexity.
• Significant on-chip memory: Approximately 33.8 Mbits of embedded RAM minimizes external memory requirements for many designs.
• Extensive I/O capability: 584 I/Os provide flexibility to interface with numerous peripherals, sensors and parallel buses without external multiplexing.
• Low-voltage core operation: Core supply from 0.970 V to 1.080 V supports power-optimized system architectures.
• Compact, assembly-ready package: 1152-FCBGA (35×35) surface-mount package simplifies high-density PCB implementations.
• Extended temperature grade: Rated 0 °C to 100 °C for applications requiring operation across a broad commercial‑range environment.

Why Choose MPF500T-FCG1152E?

The MPF500T-FCG1152E positions itself as a high-capacity PolarFire FPGA for designs that need substantial logic resources, ample embedded memory and a large I/O complement in a single, surface-mount FCBGA package. Its low-voltage core and extended temperature grade make it suitable for a wide range of commercial and industrial-oriented embedded systems.

Engineers building complex digital systems or consolidating multiple functions onto a single programmable device can leverage the MPF500T-FCG1152E to reduce PCB complexity and external component count while retaining flexible reprogrammability under the Microchip Technology product family.

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