MPF500T-FCG784I

The MPF500T-FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It provides a high-density fabric with 481,000 logic elements, approximately 33.792 Mbits of embedded memory, and 388 device I/Os in a 784-ball FCBGA package.

Key electrical and environmental characteristics include a core voltage supply range of 970 mV to 1.08 V and an operating temperature range of −40°C to 100°C, making it suitable for systems requiring extended temperature operation and high integration in a compact surface-mount package.

Key Features

• Core Logic  481,000 logic elements provide a large programmable fabric for complex logic, data-paths, and custom hardware acceleration.
• Embedded Memory  Approximately 33.792 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data storage without external memory dependency.
• High I/O Count  388 device I/Os enable dense interface routing for multi-protocol connectivity and high-pin-count subsystems.
• Power Supply  Core voltage range of 970 mV to 1.08 V to match low-voltage system architectures and ensure predictable power domains.
• Package & Mounting  784-ball FCBGA (784-FCBGA, 29×29) surface-mount package for compact, board-level integration in space-constrained designs.
• Industrial Grade  Specified for industrial-grade operation with an operating temperature range of −40°C to 100°C to support extended-temperature system deployments.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial Control Systems  Industrial-grade temperature range and high logic density make this FPGA suitable for control, automation, and motor-control subsystems.
• High-Density I/O Interfaces  With 388 I/Os, the device supports applications that require multiple parallel interfaces or large numbers of sensors and actuators.
• On-Chip Memory Intensive Logic  Approximately 33.792 Mbits of embedded RAM supports designs that need significant internal buffering, packet processing, or data queuing.

Unique Advantages

• Large Programmable Fabric: 481,000 logic elements enable complex custom logic implementations and system consolidation onto a single device.
• Substantial Embedded Memory: Approximately 33.792 Mbits of on-chip RAM reduces reliance on external memory, simplifying BOM and layout.
• Extensive I/O Resources: 388 I/Os provide flexibility to connect numerous peripherals and interfaces without external multiplexing.
• Industrial Temperature Range: Rated for −40°C to 100°C operation to meet the demands of extended-temperature deployments.
• Compact Surface-Mount Package: 784-FCBGA (29×29) offers a high-pin-count solution in a compact board footprint for space-constrained designs.
• RoHS Compliance: Supports environmentally conscious manufacturing and regulatory requirements.

Why Choose MPF500T-FCG784I?

The MPF500T-FCG784I delivers a combination of high logic capacity, significant on-chip memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. These attributes suit designs that require dense integration of custom logic, substantial internal buffering, and robust operation across a wide temperature range.

This device is appropriate for engineering teams seeking a scalable FPGA platform for industrial applications where integration density, predictable power domains, and extensive I/O are important design drivers.

If you would like pricing, availability, or to request a formal quote for MPF500T-FCG784I, please submit your inquiry and specify required quantities and any delivery or packaging preferences.