MPF500TL-FCG784I

The MPF500TL-FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade embedded applications. It delivers a high logic element count and substantial on-chip memory in a compact 784‑FCBGA package suitable for surface-mount assembly.

With a wide operating temperature range and RoHS compliance, this device targets designs that require extensive programmable logic, abundant I/O, and reliable operation across industrial temperature conditions.

Key Features

• FPGA Core  PolarFire™ family field programmable gate array architecture packaged as an integrated circuit for programmable logic implementations.
• Logic Capacity  481,000 logic elements to implement large-scale digital functions and complex custom logic.
• Embedded Memory  Approximately 33.79 Mbits of on-chip RAM for data buffering, FIFOs, and embedded storage.
• I/O Resources  388 available I/O pins to support multiple parallel interfaces and external peripherals.
• Power  Supply voltage range 970 mV to 1.08 V to match low-voltage system domains.
• Package & Mounting  784‑FCBGA (29×29) / 784‑BBGA package, surface-mount mounting type for compact board-level integration.
• Industrial Temperature & Grade  Rated for operation from -40 °C to 100 °C and specified as Industrial grade for reliable field operation.
• Environmental Compliance  RoHS compliant to support restricted-substance requirements in assemblies.

Typical Applications

• Industrial Control: Implement control logic, sensor interfacing, and deterministic processing in automation systems that require industrial temperature operation.
• Data Acquisition & Processing: High logic density and on-chip memory enable preprocessing, buffering, and aggregation of sensor or instrumentation data.
• Telecom & Networking Equipment: Use the device for protocol bridging, parallel I/O handling, and custom packet processing where many I/Os are needed.
• Embedded Compute Modules: Integrate custom hardware accelerators and glue logic within compact FCBGA form factors for space-constrained designs.

Unique Advantages

• High logic density: 481,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system BOM and board complexity.
• Substantial on-chip memory: Approximately 33.79 Mbits of embedded RAM supports large buffers and state storage without external memory.
• Robust I/O count: 388 I/Os provide flexibility to connect sensors, peripherals, and external interfaces directly to the FPGA fabric.
• Industrial-rated operation: -40 °C to 100 °C rating and Industrial grade classification for deployments in demanding environments.
• Compact, manufacturable package: 784‑FCBGA (29×29) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory readiness: RoHS compliance simplifies integration into products requiring restricted-substance adherence.

Why Choose MPF500TL-FCG784I?

The MPF500TL-FCG784I combines a large logic element count, significant embedded memory, and a high I/O complement in a compact industrial-grade FCBGA package. It is well suited for engineers building complex embedded systems, industrial controllers, or data-processing modules that need programmable flexibility and robust temperature performance.

Backed by Microchip Technology, this PolarFire™ FPGA offers a balance of integration and reliability for designs that require on-chip resources and industrial operating margins, helping teams reduce board-level complexity while meeting environmental and regulatory needs.

Request a quote or contact sales to obtain pricing, availability, and lead-time information for the MPF500TL-FCG784I. Our team can assist with volume inquiries and technical clarification to support your design evaluation.