MPF500TS-1FCG1152I

The MPF500TS-1FCG1152I is a PolarFire™ field-programmable gate array (FPGA) from Microchip Technology, provided in a 1152-FCBGA (35×35) package. It delivers a high logic capacity device with substantial embedded memory and a large I/O count, designed for industrial-grade applications requiring extended temperature and voltage ranges.

With 481,000 logic elements, approximately 33.8 Mbits of embedded RAM, and 584 I/Os, this FPGA targets designs that need dense programmable logic, significant on-chip memory, and broad external interfacing while meeting industrial temperature requirements.

Key Features

• Core Logic: 481,000 logic elements to implement complex digital functions and custom hardware acceleration.
• Embedded Memory: Approximately 33.8 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
• I/O Capacity: 584 user I/O pins to support extensive external interfacing and board-level connectivity.
• Package: 1152-FCBGA (35×35) surface-mount package suitable for high-density board layouts.
• Power Supply: Core operating voltage range from 970 mV to 1.08 V, enabling defined supply planning for low-voltage core domains.
• Temperature & Grade: Industrial grade device with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Regulatory Compliance: RoHS compliant to support environmentally conscious designs and manufacturing.

Typical Applications

• Industrial Control Systems: Industrial-grade temperature range and a large I/O count make this FPGA suitable for control, monitoring, and sensor aggregation tasks.
• High-Density Logic Designs: The 481,000 logic elements enable complex state machines, custom accelerators, and parallel processing implementations.
• Memory-Intensive Functions: Approximately 33.8 Mbits of embedded RAM supports buffering, data staging, and intermediate storage for streaming or packet-based workloads.

Unique Advantages

• Significant Logic Capacity: Large logic element count provides headroom for complex designs and future feature expansion without changing the device family.
• Ample On-Chip Memory: Substantial embedded RAM reduces dependence on external memory for many buffering and temporary storage needs, simplifying board design.
• Extensive I/O: 584 I/Os support broad peripheral connectivity and flexible pinout mapping for system integration.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, High-Density Package: 1152-FCBGA (35×35) packaging allows high-pin-count implementations in a compact footprint.
• RoHS Compliant: Meets environmental compliance requirements for modern manufacturing processes.

Why Choose MPF500TS-1FCG1152I?

The MPF500TS-1FCG1152I positions itself as a high-capacity, industrial-grade FPGA choice for engineers needing a combination of large programmable logic, significant on-chip RAM, and extensive I/O in a compact FCBGA package. Its defined voltage and temperature ranges make it appropriate for robust embedded applications where environmental margins and supply planning matter.

Designed and supplied by Microchip Technology, this device is suited to teams building scalable, memory-aware systems that require dense logic integration and reliable operation across industrial temperature ranges.

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