MPF500TLS-FCG784I

The MPF500TLS-FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology provided in a 784-ball FCBGA package. It delivers a high logic capacity and substantial embedded memory, packaged for surface-mount applications and specified for industrial temperature operation.

This device is intended for designs that require dense programmable logic, a large number of I/O, and on-chip memory while operating across an industrial temperature range.

Key Features

• Logic Capacity — 481,000 logic elements to support complex programmable logic and large-scale implementation of custom functions.
• Embedded Memory — Approximately 33.8 Mbits of on-chip RAM (33,792,000 bits) for buffering, lookup tables, and local storage.
• I/O Density — 388 user I/O pins to accommodate high-pin-count interface requirements and flexible board-level connectivity.
• Power Supply — Core voltage range from 970 mV to 1.08 V for device power provisioning.
• Package & Mounting — 784-FCBGA package (29 × 29 mm) designed for surface-mount assembly.
• Industrial Grade Temperature — Rated to operate from −40°C to 100°C for industrial environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial systems — Industrial-grade temperature rating (−40°C to 100°C) and high logic density make the device suitable for programmable control and automation equipment.
• High-density I/O designs — 388 I/O pins support boards and subsystems that require numerous interfaces or parallel connections.
• Embedded computing and acceleration — Large logic element count and on-chip RAM capacity enable implementation of compute- and memory-intensive custom logic functions.

Unique Advantages

• High logic scalability: 481,000 logic elements provide headroom for complex designs and future feature growth.
• Significant on-chip memory: Approximately 33.8 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level routing.
• Large I/O complement: 388 I/O pins enable support for multiple peripherals, parallel interfaces, and dense connector layouts.
• Industrial temperature operation: −40°C to 100°C rating supports deployment in harsher environments where extended temperature range is required.
• Compact FCBGA package: 784-ball FCBGA (29×29 mm) provides a high-density, surface-mount form factor suitable for compact system designs.
• Regulatory alignment: RoHS compliance assists with environmental and manufacturing requirements.

Why Choose MPF500TLS-FCG784I?

The MPF500TLS-FCG784I combines a large programmable logic fabric, substantial on-chip memory, and a high I/O count in a 784-FCBGA surface-mount package, positioned for industrial-grade applications. These characteristics make it appropriate for engineers developing systems that demand density, integration, and reliable operation across extended temperatures.

As a PolarFire™ FPGA from Microchip Technology, the device offers a balance of integration and capacity for designs that require scalable programmable logic and embedded memory without sacrificing I/O or temperature performance.

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