MPF500TS-FC1152M

The MPF500TS-FC1152M is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for high-density, high-reliability embedded applications. It integrates a large logic fabric, substantial on-chip memory, and a high pin-count I/O complement in a 1152‑ball FCBGA package.

With military-grade temperature performance and a low-voltage core supply range, this device targets mission-critical systems and other applications that require robust operation across demanding environmental conditions.

Key Features

• Logic Capacity  Provides 481,000 logic elements to implement complex digital functions and state machines.
• Embedded Memory  Includes approximately 34.6 Mbits of on-chip RAM for buffering, frame storage, and intermediate data processing.
• High I/O Count  584 user I/O pins support dense connectivity to peripherals, sensors, and high‑speed interfaces.
• Package  1152‑BBGA, FCBGA package in a 1152‑FCBGA (35×35) footprint for compact, high‑density board integration.
• Operating Conditions  Military grade operation with a temperature range of −55 °C to 125 °C and a core voltage supply range of 970 mV to 1.08 V.
• Mounting and Compliance  Surface mount device with RoHS compliance for modern assembly processes and environmental requirements.

Typical Applications

• Defense and Military Systems  Used for secure, ruggedized signal processing and control functions where wide temperature range and military-grade components are required.
• Aerospace Avionics  Processes control logic and on-board data buffering in avionics subsystems that demand high logic density and reliable operation.
• Mission-Critical Embedded Systems  Implements complex, deterministic logic and memory-intensive operations for systems that prioritize reliability and longevity.

Unique Advantages

• High Logic Density: 481,000 logic elements allow integration of sophisticated digital designs on a single device, reducing BOM and board complexity.
• Substantial On-Chip Memory: Approximately 34.6 Mbits of embedded RAM supports buffering, packet storage, and local data processing without external memory.
• Extensive I/O: 584 I/O pins provide flexibility for interfacing to multiple peripherals, sensors, and system buses.
• Military-Grade Thermal Performance: Rated for −55 °C to 125 °C operation to meet the needs of harsh-environment applications.
• Compact FCBGA Packaging: 1152‑ball FCBGA (35×35) footprint enables high-density board layouts while maintaining robust electrical connectivity.
• Low-Voltage Core Supply: Operates from 970 mV to 1.08 V, compatible with modern low-voltage power domains.

Why Choose MPF500TS-FC1152M?

The MPF500TS-FC1152M offers a balanced combination of high logic element count, significant embedded memory, and a large I/O complement within a military-grade temperature envelope. These attributes make it appropriate for designers building complex, reliability-focused systems that require integration of substantial digital functionality on a single FPGA.

Its 1152‑ball FCBGA package and surface-mount form factor help conserve board area while supporting dense connectivity. RoHS compliance and the specified voltage and temperature ranges provide predictable, verifiable characteristics for procurement and long-term deployment.

If you would like pricing, availability, or to request a quote for the MPF500TS-FC1152M, submit an inquiry to start the procurement process.