MPF500TS-FC784M

The MPF500TS-FC784M is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high-density logic fabric with a large on-chip memory complement and extensive I/O, packaged in a 784-ball FCBGA intended for surface-mount applications.

Designed for military-grade deployments, this device targets systems that require long temperature range operation and high logic and memory capacity under a controlled supply voltage window.

Key Features

• Logic Capacity — 481,000 logic elements and 120,250 CLBs provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 34.6 Mbits of on-chip RAM to support buffering, state storage, and embedded data processing without external memory.
• I/O Density — 388 user I/Os support dense peripheral and board-level connectivity requirements.
• Package and Mounting — Supplied in a 784-BBGA / 784-FCBGA (29×29) package for surface-mount PCB assembly.
• Power Supply — Operates over a defined core supply range of 970 mV to 1.08 V to match regulated power-rail designs.
• Environmental Grade — Military grade device with an operating temperature range of −55 °C to 125 °C for demanding thermal environments.
• Compliance — RoHS compliant to meet regulatory environmental requirements.

Typical Applications

• Military and Defense Systems — Suitable for ruggedized avionics, tactical electronics, and other military applications where extended temperature range and military grade components are required.
• High-Density I/O Systems — Ideal for systems that need many external interfaces or board-level signal routing using the device’s 388 I/Os.
• Compute-Intensive Embedded Designs — Large logic capacity and significant on-chip RAM enable complex protocol handling, control logic, and data buffering within a single device.

Unique Advantages

• High Logic Integration: 481,000 logic elements and 120,250 CLBs allow consolidation of complex functions into a single FPGA, reducing system BOM and board area.
• Significant On-Chip Memory: Approximately 34.6 Mbits of embedded RAM reduces dependence on external memory and simplifies memory architecture.
• Robust Thermal Range: −55 °C to 125 °C operation supports deployment in harsh and temperature-extreme environments.
• Compact, High-Pin Package: 784-FCBGA (29×29) offers a high pin count in a compact form factor for dense routing and high-speed board layouts.
• Controlled Core Voltage: Narrow supply window (970 mV to 1.08 V) supports designs with precise power management and predictable core behavior.
• RoHS Compliant: Meets standard environmental compliance expectations for modern electronics manufacturing.

Why Choose MPF500TS-FC784M?

The MPF500TS-FC784M positions itself as a high-density, military-grade FPGA for designs that demand extensive programmable logic, sizable embedded memory, and plentiful I/O in a compact FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for long-life and environmentally demanding projects.

Engineers and procurement teams specifying this device will benefit from its balance of logic capacity, on-chip RAM, and I/O count when consolidating multiple functions into a single FPGA. The controlled supply and robust package provide predictable operation for mission-critical systems.

Request a quote or submit a pricing inquiry for the MPF500TS-FC784M to evaluate fit and availability for your project needs.