OR2C04A4J160-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 160 6400 400 160-BQFP |
|---|---|
| Quantity | 502 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 160-QFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 160-BQFP | Number of I/O | 160 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH not applicable | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 100 | Number of Logic Elements/Cells | 400 | ||
| Number of Gates | 11000 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 6400 |
Overview of OR2C04A4J160-DB – ORCA™2 Field Programmable Gate Array (FPGA) IC, 160 I/O, 400 Logic Elements, 160-BQFP
The OR2C04A4J160-DB is an ORCA™2 field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides a compact, commercial-grade FPGA fabric with moderate logic capacity and on-chip RAM for implementing configurable digital logic.
This device combines 400 logic elements, approximately 6,400 bits of embedded RAM, and up to 160 I/O pins in a 160-pin BQFP surface-mount package, making it suitable for commercial embedded designs that require flexible I/O and moderate programmable logic integration.
Key Features
- Logic Capacity 400 logic elements (cells) and an estimated 11,000 equivalent gates for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 6,400 bits of on-chip RAM to support small buffers, FIFOs, and state storage.
- I/O Density Up to 160 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Power Operates from a 3 V to 3.6 V supply range suitable for commercial 3.3 V systems.
- Package & Mounting 160-BQFP surface-mount package; supplier package listed as 160-QFP (28×28) for compact PCB integration.
- Operating Range Commercial operating temperature range of 0 °C to 70 °C.
- RoHS Compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- Commercial embedded systems Implement moderate-density logic and I/O control in consumer and industrial-commercial products.
- Interface bridging and glue logic Aggregate and translate signals between multiple peripherals using the device's 160 I/O pins.
- Prototyping and evaluation Develop and validate small to mid-scale FPGA designs that require up to 400 logic elements and embedded RAM.
Unique Advantages
- Balanced logic and memory A combination of 400 logic elements with approximately 6.4 Kbits of RAM provides a practical balance for control, glue logic, and small data handling tasks.
- High I/O count in a compact package 160 I/O pins in a 160-BQFP (160-QFP supplier package) simplifies board-level connectivity while keeping board footprint modest.
- Commercial-grade suitability Rated for 0 °C to 70 °C operation and a 3.0 V–3.6 V supply, aligning with common commercial system requirements.
- Surface-mount convenience Designed for surface-mount assembly to support automated manufacturing and compact PCB layouts.
- RoHS compliance Facilitates adherence to environmental and materials regulations for commercial products.
Why Choose OR2C04A4J160-DB?
The OR2C04A4J160-DB delivers a practical FPGA option for designers seeking moderate programmable logic capacity with substantial I/O in a compact, surface-mount 160-pin package. Its balance of 400 logic elements, on-chip RAM, and 160 I/O pins makes it well-suited for commercial embedded designs that require flexible interfacing and configurable digital logic.
Backed by Lattice Semiconductor Corporation and built to RoHS standards, this commercial-grade FPGA is positioned for projects where moderate density, low-voltage operation, and reliable board-level integration matter to shorten development cycles and simplify BOMs.
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