MPF500TS-FCG1152I

The MPF500TS-FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It combines a high logic capacity and substantial on-chip memory with a large I/O count in a 1152-ball FCBGA package for dense, board-level integration.

Targeted at designs that require significant programmable logic, embedded memory and extensive interfacing, this device delivers the capacity and environmental range needed for industrial control, communications infrastructure, and complex signal-processing applications.

Key Features

• Core Logic  Provides 120,250 logic elements and 481,000 logic cells to implement large-scale custom logic and parallel processing functions.
• Embedded Memory  Approximately 33.8 Mbits of on-chip RAM for buffering, frame storage, and on-device data manipulation.
• I/O Capacity  584 programmable I/Os to support extensive peripheral interfacing and multi-channel connectivity.
• Power Supply Range  Operates from 970 mV to 1.08 V core supply, enabling designs that require defined low‑voltage core operation.
• Package and Mounting  1152-FCBGA (35×35 mm) package, surface-mount construction for compact, high-density PCB implementations.
• Temperature Range  Rated for industrial operation from −40 °C to 100 °C to meet elevated ambient and harsh-environment requirements.
• Regulatory Compliance  RoHS-compliant construction for environmentally conscious manufacturing and assembly processes.

Typical Applications

• Industrial Control  Implement real-time control logic and complex state machines using the device's large logic capacity and industrial temperature rating.
• Communications Infrastructure  Use extensive I/O and embedded RAM for packet buffering, protocol bridging, and custom data-path implementations.
• Imaging and Sensor Processing  Leverage abundant logic cells and on-chip memory to perform parallel processing, frame buffering, and pre-processing of sensor data.
• High-Density I/O Systems  Address multi-channel interfaces and board-level consolidation with 584 available I/O pins in a compact FCBGA package.

Unique Advantages

• High Logic Capacity: 120,250 logic elements and 481,000 logic cells enable implementation of complex, custom architectures on a single device.
• Significant On-Chip Memory: Approximately 33.8 Mbits of embedded RAM reduces dependence on external memory for buffering and accelerates data-path designs.
• Extensive I/O Count: 584 I/Os allow integration of many peripherals and interfaces without additional glue logic or IO expansion.
• Industrial Temperature Rating: −40 °C to 100 °C qualification supports deployment in harsh and industrial environments.
• Compact, High-Density Package: 1152-FCBGA (35×35 mm) supports high pin-count designs while minimizing board footprint.
• RoHS Compliance: Built to meet RoHS requirements for environmentally responsible production.

Why Choose MPF500TS-FCG1152I?

The MPF500TS-FCG1152I positions itself as a robust, high-capacity FPGA option for projects that demand large programmable logic resources, substantial embedded memory and extensive interfacing in an industrial-grade device. Its combination of logic elements, memory and I/O makes it suitable for dense, feature-rich designs where consolidation and on-chip processing are priorities.

Backed by Microchip Technology and delivered in a 1152-ball FCBGA package with industrial temperature capability and RoHS compliance, this device offers a scalable hardware building block for system designers focused on long-term deployment and reliability.

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