MPF500TS-1FCG784I

The MPF500TS-1FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial-grade applications. It provides a high-density programmable fabric with 481,000 logic elements and approximately 33.8 Mbits of embedded memory, supporting complex digital functions and custom logic integration.

Packaged in a 784-FCBGA (29 × 29) surface-mount package and rated for operation from -40°C to 100°C, the device is aimed at designs that require significant I/O capacity, dense logic resources, and low-voltage core operation between 0.97 V and 1.08 V.

Key Features

• Core Logic 481,000 logic elements provide substantial programmable logic capacity for complex implementations and high-density designs.
• Embedded Memory Approximately 33.8 Mbits of on-chip RAM to support buffering, tables, and on-chip data storage without external memory for many functions.
• I/O and Package 388 I/O pins delivered in a 784-FCBGA (29×29) surface-mount package for broad connectivity and compact board-level integration.
• Operating Range Industrial-grade temperature range of -40°C to 100°C for use in thermally demanding environments.
• Power Core supply voltage specified from 0.97 V to 1.08 V to match low-voltage system architectures.
• Device Density (CLB Equivalent) 120,250 CLB-like units reported to reflect the FPGA’s configurable logic block capacity for structured logic design.
• Compliance RoHS compliant material status for regulated supply-chain requirements.

Typical Applications

• Industrial Control Use in industrial automation and control systems that require a wide operating temperature range and robust, high-density logic resources.
• High‑Density Embedded Systems Suitable for embedded designs needing large logic capacity and substantial on-chip RAM for compute and buffering tasks.
• Board-Level Integration Compact 784-FCBGA surface-mount package and 388 I/O support dense, space-constrained PCB designs requiring many external interfaces.

Unique Advantages

• High Logic Capacity: 481,000 logic elements enable implementation of complex FPGA designs without immediate partitioning across multiple devices.
• Significant On-Chip Memory: Approximately 33.8 Mbits of embedded RAM reduce reliance on external memory for many data-intensive functions.
• Extensive I/O Count: 388 I/O pins provide flexibility for interfacing with sensors, peripherals, and system buses.
• Industrial Temperature Rating: Rated from -40°C to 100°C to support deployment in thermally challenging environments.
• Low-Voltage Core Compatibility: Core supply range of 0.97 V to 1.08 V aligns with low-voltage system architectures.
• Compact FCBGA Packaging: 784-FCBGA (29×29) surface-mount package balances high pin count with board-space efficiency.

Why Choose MPF500TS-1FCG784I?

The MPF500TS-1FCG784I positions itself as a high-density, industrial-grade FPGA option from Microchip Technology, combining a large pool of logic elements, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its specified operating temperature range and RoHS compliance make it suitable for demanding embedded and industrial applications that need durable programmable logic with significant on-chip resources.

This device is a fit for engineering teams designing systems that require scalable logic capacity, integrated memory for data handling, and broad connectivity, while operating within a low-voltage core domain.

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