MPF500TLS-FCG1152I

The MPF500TLS-FCG1152I is a PolarFire™ field programmable gate array (FPGA) in a 1152-ball FCBGA package designed for high-density digital integration. With 481,000 logic elements and approximately 33.8 Mbits of embedded memory, this device targets applications that require substantial on-chip logic and memory resources combined with a large I/O count.

Built for surface-mount assembly and rated for industrial operation from -40 °C to 100 °C, the MPF500TLS-FCG1152I supports designs that demand robust temperature tolerance, significant I/O connectivity, and a core supply range of 0.97 V to 1.08 V.

Key Features

• Logic Capacity — 481,000 logic elements suitable for complex custom digital functions and hardware-accelerated processing.
• Embedded Memory — Approximately 33.8 Mbits of on-chip RAM to support large data buffers, state machines, and memory-intensive logic.
• I/O Resources — 584 I/O pins providing extensive external connectivity for multi-protocol interfaces and high-pin-count designs.
• Package & Mounting — 1152-FCBGA (35×35) package in a surface-mount form factor for compact board-level integration.
• Power — Core voltage supply range of 0.97 V to 1.08 V to match system power-rail planning and core-level requirements.
• Industrial Temperature Range — Operational from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS compliant to meet standard environmental restrictions for electronic assemblies.

Typical Applications

• Industrial Automation — Large logic capacity and extended temperature rating enable control, sequencing, and custom logic functions in factory automation and process control systems.
• I/O-Intensive Systems — 584 I/O pins facilitate protocol bridging, sensor/fleet interfacing, and multi-channel data acquisition where many external connections are required.
• Embedded Acceleration — Combined logic and on-chip RAM support hardware acceleration of compute-heavy tasks and custom signal processing pipelines.

Unique Advantages

• High Logic Density: 481,000 logic elements let you implement complex functions on a single device, reducing board-level partitioning.
• Substantial On-Chip Memory: Approximately 33.8 Mbits of embedded RAM minimizes external memory dependencies for latency-sensitive designs.
• Extensive I/O: 584 I/O pins provide flexibility to connect multiple peripherals and interfaces without multiplexing compromises.
• Industrial Robustness: Rated for -40 °C to 100 °C operation to support deployments in harsh or temperature-variable environments.
• Compact Packaging: 1152-FCBGA (35×35) surface-mount package offers a balance of high pin count and compact PCB footprint.
• Standards-Conscious Design: RoHS compliance supports environmentally regulated manufacturing and end-product requirements.

Why Choose MPF500TLS-FCG1152I?

The MPF500TLS-FCG1152I combines large-scale logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package, making it well suited for industrial and I/O-rich designs that require reliable operation across a wide temperature range. Its core voltage range and surface-mount form factor allow straightforward integration into modern system architectures.

This device is ideal for engineering teams building systems that need on-chip capacity for complex logic and memory without relying heavily on external components, offering a path to simplified BOMs and consolidated board designs while meeting industrial environmental requirements.

Request a quote or contact sales to discuss availability, pricing, and how MPF500TLS-FCG1152I can fit into your next design.