MPF500TL-FCG784E

The MPF500TL-FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large resource set including 481,000 logic elements, approximately 33.8 Mbits of embedded memory, and up to 388 I/O signals for densely integrated digital designs.

This surface-mount device in a 784-FCBGA (29×29) package is offered in an Extended grade with an operating temperature range of 0°C to 100°C and a core voltage supply range of 970 mV to 1.08 V, making it suitable for production applications that require substantial on-chip logic and memory resources.

Key Features

• Core Logic 481,000 logic elements provide a large fabric for implementing complex digital designs and custom logic functions.
• Embedded Memory Approximately 33.8 Mbits of on-chip RAM to support buffering, state storage, and data processing without extensive external memory.
• I/O Capacity Up to 388 I/O pins to accommodate high-connectivity designs and multiple peripheral interfaces.
• Power Supply Core voltage operation from 970 mV to 1.08 V, allowing compatibility with low-voltage FPGA power domains.
• Package and Mounting 784-FCBGA (29×29) package, supplied as a surface-mount device for compact board-level integration; package case listed as 784-BBGA, FCBGA.
• Operating Grade and Temperature Extended grade with an operating temperature range of 0°C to 100°C for deployment in production environments with standard thermal requirements.
• Environmental Compliance RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• I/O-Intensive Systems — Use the high I/O count to interface with multiple sensors, peripherals, and subsystems in consolidated designs.
• Compute and Acceleration — Large logic and embedded memory resources enable custom compute blocks and data-path acceleration within a single FPGA fabric.
• Prototyping and System Integration — Dense logic capacity and on-chip RAM support complex prototype designs and integration of multiple functions onto one device.

Unique Advantages

• High Logic Capacity: 481,000 logic elements let you implement large-scale digital functions without splitting designs across multiple devices.
• Significant On-Chip Memory: Approximately 33.8 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• Generous I/O Count: Up to 388 I/O points support complex interfacing and high pin-count requirements.
• Compact FCBGA Package: 784-FCBGA (29×29) provides a space-efficient package for dense product designs.
• Extended Temperature Grade: 0°C to 100°C rating supports a range of production environments while meeting standard thermal needs.
• Regulatory Compliance: RoHS compliance aligns with common manufacturing and environmental requirements.

Why Choose MPF500TL-FCG784E?

The MPF500TL-FCG784E positions itself as a high-capacity PolarFire FPGA option for designers who need extensive logic resources, substantial embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its extended-grade temperature range and RoHS compliance make it suitable for production deployments that rely on predictable thermal and environmental characteristics.

Manufactured by Microchip Technology, this device fits designs that require scalable on-chip resources and a consolidated hardware footprint—helping to reduce board complexity while keeping critical logic and memory close to the data path.

Request a quote or submit a request for pricing and availability to receive more information and start the procurement process for the MPF500TL-FCG784E.