MPF500TL-FCG1152I

The MPF500TL-FCG1152I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a high-pin-count 1152-ball FCBGA package. This device provides a large logic fabric, significant on-chip memory, and extensive I/O capacity for complex digital designs.

With 481,000 logic elements, approximately 33.8 Mbits of embedded memory and 584 I/O pins, the MPF500TL-FCG1152I targets industrial-grade applications that require high integration, scalable logic resources and broad interfacing options. The device is RoHS compliant and specified for surface-mount assembly.

Key Features

• Core Logic  481,000 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 33.8 Mbits of on-chip RAM to support large buffers, FIFOs and local storage.
• I/O Density  584 I/O pins to accommodate multiple high-density interfaces and broad system connectivity.
• Package  1152-BBGA / 1152-FCBGA packaging (supplier device package listed as 1152-FCBGA (35×35)) for compact, high-pin-count board integration.
• Power  Core supply range of 0.97 V to 1.08 V to match system power-rail requirements.
• Thermal and Environmental  Industrial operating temperature range of -40°C to 100°C suitable for demanding environments.
• Mounting and Compliance  Surface mount device with RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

• Industrial Control and Automation  Use the device's 481,000 logic elements and industrial temperature rating for control, signal processing and real-time logic in industrial equipment.
• High-Density I/O Systems  584 I/O pins support multi-channel data aggregation, sensor interfaces and peripheral connectivity in compact systems.
• Embedded Memory-Intensive Designs  Approximately 33.8 Mbits of embedded RAM enables on-chip buffering, packet processing and local data storage.
• Compact, High-Pin-Count Board Designs  The 1152-FCBGA package provides a dense I/O and logic solution for space-constrained PCBs.

Unique Advantages

• High Logic Capacity: 481,000 logic elements provide room for complex algorithms and large digital subsystems without needing external logic devices.
• Substantial On-Chip Memory: Approximately 33.8 Mbits of embedded RAM reduces dependence on external memory and simplifies system architecture.
• Extensive I/O Availability: 584 I/O pins enable flexible connectivity and support for multiple parallel interfaces.
• Industrial Temperature Range: Rated from -40°C to 100°C for deployment in temperature-challenging environments.
• Compact FCBGA Packaging: 1152-ball FCBGA (1152-FCBGA (35×35)) delivers a high pin-count solution in a compact footprint for dense board layouts.
• Low Core Voltage Range: Core supply specified between 0.97 V and 1.08 V for compatibility with modern power-rail designs.

Why Choose MPF500TL-FCG1152I?

The MPF500TL-FCG1152I combines substantial logic density, significant embedded memory and a large I/O complement in a single, industrial-grade PolarFire™ FPGA package from Microchip Technology. Its specification set supports designers who need integrated, high-capacity programmable logic and on-chip memory while meeting surface-mount assembly and RoHS requirements.

This device is well suited to teams building industrial systems, data aggregation hardware and other applications that require scalable logic resources, compact high-pin-count packaging and operation across a wide temperature range. Choosing the MPF500TL-FCG1152I delivers a high-integration FPGA option for long-lived, robust designs.

Request a quote or submit a purchase inquiry today to evaluate MPF500TL-FCG1152I for your next design.