MPF500TL-FCG1152E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 584 33792000 481000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,391 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 584 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 120250 | Number of Logic Elements/Cells | 481000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 33792000 |
Overview of MPF500TL-FCG1152E – PolarFire™ Field Programmable Gate Array (FPGA) IC, 481,000 logic elements
The MPF500TL-FCG1152E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large logic fabric in a high-density FCBGA package with a broad I/O complement and embedded on-chip memory.
Designed for systems requiring significant programmable logic, concentrated on-chip memory, and high pin-count connectivity, this extended-grade device targets applications that need integration and scalability within a 1152-FCBGA (35×35) form factor.
Key Features
- Core FPGA PolarFire™ Field Programmable Gate Array architecture in a single-chip FPGA IC.
- Logic Capacity Approximately 481,000 logic elements to implement complex digital functions and custom logic blocks.
- Embedded Memory Approximately 33.8 Mbits of on-chip RAM (33,792,000 total RAM bits) for buffer, FIFO, and workspace requirements.
- I/O Resources 584 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
- Power Core voltage supply range of 970 mV to 1.08 V for the FPGA core domain.
- Package & Mounting 1152-FCBGA (35×35) supplier device package / 1152-BBGA FCBGA package case, surface-mount mounting type for compact, high-density board layouts.
- Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic integration: Large logic element count enables complex designs on a single FPGA, reducing the need for multiple devices.
- Substantial on-chip memory: Approximately 33.8 Mbits of embedded RAM helps minimize external memory dependency and simplifies PCB routing.
- Extensive I/O availability: 584 I/O pins provide flexibility for multi-protocol interfaces and dense connectivity requirements.
- Compact, high-density package: 1152-FCBGA (35×35) package supports space-constrained, high-performance board designs.
- Low-voltage core: Nominal core supply range of 970 mV–1.08 V aligns with modern low-voltage power architectures.
- Extended-grade operating range: Rated for 0 °C to 100 °C operation to match designs requiring an extended commercial temperature window.
Why Choose MPF500TL-FCG1152E?
The MPF500TL-FCG1152E positions itself as a high-capacity, integrated FPGA solution that combines nearly half a million logic elements, substantial embedded memory, and a large I/O count within a compact 1152-FCBGA package. Its extended-grade rating and RoHS compliance make it suitable for designs that require a balance of integration, scale, and environmental compliance.
This device is appropriate for design teams needing significant on-chip resources and dense connectivity in a single FPGA. The combination of logic density, embedded RAM, and high pin count helps reduce external component count and supports more compact, integrated system designs while providing a clear upgrade path within the PolarFire™ FPGA family.
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