MPF500TL-FCG1152E

IC FPGA 584 I/O 1152FCBGA
Part Description

PolarFire™ Field Programmable Gate Array (FPGA) IC 584 33792000 481000 1152-BBGA, FCBGA

Quantity 1,391 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O584Voltage970 mV - 1.08 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs120250Number of Logic Elements/Cells481000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits33792000

Overview of MPF500TL-FCG1152E – PolarFire™ Field Programmable Gate Array (FPGA) IC, 481,000 logic elements

The MPF500TL-FCG1152E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large logic fabric in a high-density FCBGA package with a broad I/O complement and embedded on-chip memory.

Designed for systems requiring significant programmable logic, concentrated on-chip memory, and high pin-count connectivity, this extended-grade device targets applications that need integration and scalability within a 1152-FCBGA (35×35) form factor.

Key Features

  • Core FPGA  PolarFire™ Field Programmable Gate Array architecture in a single-chip FPGA IC.
  • Logic Capacity  Approximately 481,000 logic elements to implement complex digital functions and custom logic blocks.
  • Embedded Memory  Approximately 33.8 Mbits of on-chip RAM (33,792,000 total RAM bits) for buffer, FIFO, and workspace requirements.
  • I/O Resources  584 user I/O pins to support high-pin-count interfaces and multi-channel connectivity.
  • Power  Core voltage supply range of 970 mV to 1.08 V for the FPGA core domain.
  • Package & Mounting  1152-FCBGA (35×35) supplier device package / 1152-BBGA FCBGA package case, surface-mount mounting type for compact, high-density board layouts.
  • Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic integration: Large logic element count enables complex designs on a single FPGA, reducing the need for multiple devices.
  • Substantial on-chip memory: Approximately 33.8 Mbits of embedded RAM helps minimize external memory dependency and simplifies PCB routing.
  • Extensive I/O availability: 584 I/O pins provide flexibility for multi-protocol interfaces and dense connectivity requirements.
  • Compact, high-density package: 1152-FCBGA (35×35) package supports space-constrained, high-performance board designs.
  • Low-voltage core: Nominal core supply range of 970 mV–1.08 V aligns with modern low-voltage power architectures.
  • Extended-grade operating range: Rated for 0 °C to 100 °C operation to match designs requiring an extended commercial temperature window.

Why Choose MPF500TL-FCG1152E?

The MPF500TL-FCG1152E positions itself as a high-capacity, integrated FPGA solution that combines nearly half a million logic elements, substantial embedded memory, and a large I/O count within a compact 1152-FCBGA package. Its extended-grade rating and RoHS compliance make it suitable for designs that require a balance of integration, scale, and environmental compliance.

This device is appropriate for design teams needing significant on-chip resources and dense connectivity in a single FPGA. The combination of logic density, embedded RAM, and high pin count helps reduce external component count and supports more compact, integrated system designs while providing a clear upgrade path within the PolarFire™ FPGA family.

Request a quote or submit a sales inquiry to receive pricing and availability information for the MPF500TL-FCG1152E.

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