OR2C06A4BA256-DB
| Part Description |
ORCA™2 Field Programmable Gate Array (FPGA) IC 192 9216 576 256-BGA |
|---|---|
| Quantity | 69 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-PBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 192 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Affected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 144 | Number of Logic Elements/Cells | 576 | ||
| Number of Gates | 15900 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 9216 |
Overview of OR2C06A4BA256-DB – ORCA™2 FPGA, 192 I/O, 576 logic elements, 9,216-bit RAM, 256-BGA
The OR2C06A4BA256-DB is an ORCA™2 field programmable gate array (FPGA) IC offering configurable logic and on-chip memory in a compact 256-ball BGA package. It provides 576 logic elements, 9,216 bits of embedded RAM and up to 192 I/O pins for designs that require moderate programmable logic density and flexible I/O connectivity.
Engineered for commercial-grade applications, this device operates from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C ambient range, and is supplied in a 256-PBGA (27×27) surface-mount package for space-efficient system integration.
Key Features
- Programmable Logic Provides 576 logic elements (LEs) suitable for implementing custom combinational and sequential logic functions.
- On-Chip Memory Includes 9,216 bits of embedded RAM to support small buffers, FIFOs, and state storage without external memory.
- I/O Capacity Up to 192 general-purpose I/O pins enable multiple interfaces, parallel connections and signal routing to external peripherals.
- Gate Count Approximately 15,900 gates, offering a clear metric for design partitioning and resource planning.
- Package & Mounting 256-BGA package (supplier device package: 256-PBGA, 27×27) in a surface-mount form factor for compact PCB layouts.
- Power & Temperature Single-supply operation from 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
- Regulatory Compliance RoHS compliant for environmentally responsible assembly and supply-chain compatibility.
Typical Applications
- Embedded Control Use the device to implement control logic and sequencing functions where moderate logic density and on-chip RAM are sufficient.
- Interface Bridging Leverage up to 192 I/O pins to bridge multiple parallel or serial interfaces between system components.
- Glue Logic Deploy the FPGA as programmable glue logic to integrate discrete functions and simplify PCB routing in commercial electronic products.
Unique Advantages
- Balanced Resource Set: 576 logic elements paired with 9,216 bits of RAM deliver a practical balance of logic and memory for many mid-density designs.
- High I/O Count: 192 I/O pins provide versatility for interfacing with sensors, controllers and peripheral devices without immediate need for external expanders.
- Compact Surface-Mount Package: 256-PBGA (27×27) package enables dense PCB integration while maintaining a clear footprint for board-level designs.
- Commercial Temperature Rating: Specified 0 °C to 70 °C operation aligns with standard commercial electronics deployment and testing practices.
- Simple Power Domain: Standard 5 V supply range (4.75 V to 5.25 V) eases power-supply planning for legacy and existing commercial systems.
- RoHS Compliant: Supports environmentally conscious manufacturing and compliance requirements.
Why Choose OR2C06A4BA256-DB?
The OR2C06A4BA256-DB positions itself as a practical FPGA option for commercial designs that need a mid-range mix of programmable logic, embedded RAM and substantial I/O count in a compact BGA package. Its 576 logic elements, 9,216 bits of on-chip memory and 192 I/O pins make it suitable for tasks such as protocol bridging, control logic and glue functions where a commercial temperature range and a 5 V supply are acceptable.
Choosing this part supports streamlined BOMs and compact board layouts thanks to the surface-mount 256-PBGA package, and its RoHS compliance aids environmental and regulatory alignment. It is a clear candidate for designers and procurement teams targeting reliable, mid-density FPGA capability in commercial electronic products.
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