OR2C06A4BA256-DB

FPGA, 144 CLBS, 6900 GATES
Part Description

ORCA™2 Field Programmable Gate Array (FPGA) IC 192 9216 576 256-BGA

Quantity 69 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Device Package256-PBGA (27x27)GradeCommercialOperating Temperature0°C – 70°C
Package / Case256-BGANumber of I/O192Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Affected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs144Number of Logic Elements/Cells576
Number of Gates15900ECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits9216

Overview of OR2C06A4BA256-DB – ORCA™2 FPGA, 192 I/O, 576 logic elements, 9,216-bit RAM, 256-BGA

The OR2C06A4BA256-DB is an ORCA™2 field programmable gate array (FPGA) IC offering configurable logic and on-chip memory in a compact 256-ball BGA package. It provides 576 logic elements, 9,216 bits of embedded RAM and up to 192 I/O pins for designs that require moderate programmable logic density and flexible I/O connectivity.

Engineered for commercial-grade applications, this device operates from a 4.75 V to 5.25 V supply and within a 0 °C to 70 °C ambient range, and is supplied in a 256-PBGA (27×27) surface-mount package for space-efficient system integration.

Key Features

  • Programmable Logic  Provides 576 logic elements (LEs) suitable for implementing custom combinational and sequential logic functions.
  • On-Chip Memory  Includes 9,216 bits of embedded RAM to support small buffers, FIFOs, and state storage without external memory.
  • I/O Capacity  Up to 192 general-purpose I/O pins enable multiple interfaces, parallel connections and signal routing to external peripherals.
  • Gate Count  Approximately 15,900 gates, offering a clear metric for design partitioning and resource planning.
  • Package & Mounting  256-BGA package (supplier device package: 256-PBGA, 27×27) in a surface-mount form factor for compact PCB layouts.
  • Power & Temperature  Single-supply operation from 4.75 V to 5.25 V and commercial operating temperature range of 0 °C to 70 °C.
  • Regulatory Compliance  RoHS compliant for environmentally responsible assembly and supply-chain compatibility.

Typical Applications

  • Embedded Control  Use the device to implement control logic and sequencing functions where moderate logic density and on-chip RAM are sufficient.
  • Interface Bridging  Leverage up to 192 I/O pins to bridge multiple parallel or serial interfaces between system components.
  • Glue Logic  Deploy the FPGA as programmable glue logic to integrate discrete functions and simplify PCB routing in commercial electronic products.

Unique Advantages

  • Balanced Resource Set:  576 logic elements paired with 9,216 bits of RAM deliver a practical balance of logic and memory for many mid-density designs.
  • High I/O Count:  192 I/O pins provide versatility for interfacing with sensors, controllers and peripheral devices without immediate need for external expanders.
  • Compact Surface-Mount Package:  256-PBGA (27×27) package enables dense PCB integration while maintaining a clear footprint for board-level designs.
  • Commercial Temperature Rating:  Specified 0 °C to 70 °C operation aligns with standard commercial electronics deployment and testing practices.
  • Simple Power Domain:  Standard 5 V supply range (4.75 V to 5.25 V) eases power-supply planning for legacy and existing commercial systems.
  • RoHS Compliant:  Supports environmentally conscious manufacturing and compliance requirements.

Why Choose OR2C06A4BA256-DB?

The OR2C06A4BA256-DB positions itself as a practical FPGA option for commercial designs that need a mid-range mix of programmable logic, embedded RAM and substantial I/O count in a compact BGA package. Its 576 logic elements, 9,216 bits of on-chip memory and 192 I/O pins make it suitable for tasks such as protocol bridging, control logic and glue functions where a commercial temperature range and a 5 V supply are acceptable.

Choosing this part supports streamlined BOMs and compact board layouts thanks to the surface-mount 256-PBGA package, and its RoHS compliance aids environmental and regulatory alignment. It is a clear candidate for designers and procurement teams targeting reliable, mid-density FPGA capability in commercial electronic products.

Request a quote or submit an inquiry to get pricing and availability for the OR2C06A4BA256-DB. Our team can provide lead-time details and support for your procurement needs.

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