MPF500T-1FCG784I

The MPF500T-1FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high logic density FPGA fabric combined with substantial on-chip RAM and a large I/O count in a 784-ball FCBGA package.

Designed for applications that require programmable logic, embedded memory, and robust operation across a wide temperature range, this industrial-grade device targets systems requiring deterministic logic resources and flexible I/O integration.

Key Features

• Programmable Logic – 481,000 logic elements to implement complex digital functions and custom logic architectures.
• Embedded Memory – Approximately 33.8 Mbits of embedded memory for buffering, frame storage, and on-chip data processing.
• I/O Density – 388 I/O pins to support broad peripheral and interface connectivity requirements.
• Power – Core voltage supply range from 970 mV to 1.08 V, enabling low-voltage FPGA operation.
• Package & Mounting – 784-BBGA / 784-FCBGA (29×29) package in a surface-mount form factor for high-density board designs.
• Industrial Temperature Range – Rated for operation from −40 °C to 100 °C for use in demanding environments.
• Compliance – RoHS compliant.

Typical Applications

• Industrial Control – Implement motor control, PLC logic, and real-time deterministic processing using the large logic capacity and industrial temperature support.
• Communications Equipment – Use the high I/O count and on-chip memory for protocol processing, packet buffering, and interface bridging.
• Data Acquisition & Signal Processing – Leverage the embedded RAM and dense logic to perform on-device filtering, aggregation, and real-time data handling.

Unique Advantages

• High Logic Capacity: 481,000 logic elements accommodate complex designs and custom IP integration.
• Substantial On-Chip Memory: Approximately 33.8 Mbits of embedded memory reduces dependence on external RAM and simplifies board-level design.
• Extensive I/O: 388 I/Os enable wide connectivity for sensors, high-speed interfaces, and peripheral expansion.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet temperature demands of industrial applications.
• Space-Efficient Package: 784-FCBGA (29×29) surface-mount package supports compact, high-density PCB layouts.
• Regulatory Compliance: RoHS compliant for use in environments requiring lead-free components.

Why Choose MPF500T-1FCG784I?

The MPF500T-1FCG784I positions itself as a high-capacity, industrial-grade FPGA solution combining hundreds of thousands of logic elements, substantial embedded memory, and a large I/O complement in a compact FCBGA package. Its low-voltage core range and wide operating temperature make it suitable for designs that require robust, efficient programmable logic in challenging environments.

This part is well suited for teams building scalable, long-lived systems that need on-chip resources to minimize external components while maintaining flexibility to implement custom logic and interfaces.

Request a quote or submit an inquiry for pricing and availability of the MPF500T-1FCG784I to move your design forward.