MPF300TL-FCVG484I

The MPF300TL-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a large programmable fabric and embedded memory in a 484-FCBGA surface-mount package, targeted for industrial applications and complex embedded systems.

With approximately 300,000 logic elements, roughly 21.09 Mbits of on-chip RAM and 284 I/Os, this device is suited for designs that require high logic density, substantial local memory, and a broad I/O count while operating across an industrial temperature range.

Key Features

• FPGA Core PolarFire™ Field Programmable Gate Array architecture in an integrated IC form factor.
• Logic Capacity Approximately 300,000 logic elements to implement complex, custom logic and processing pipelines.
• Embedded Memory Approximately 21.09 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
• I/O Resources 284 user I/Os providing extensive connectivity options for external peripherals and interfaces.
• Power Core voltage supply range of 0.970 V to 1.080 V for integration with low-voltage power domains.
• Package & Mounting 484-FCBGA (19×19) package in a surface-mount format for compact board-level integration.
• Temperature & Grade Industrial grade device rated for operation from -40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control & Automation — Use the device's industrial temperature rating, high logic capacity and ample I/Os for machine control, PLC augmentation and real-time signal processing.
• Communications & Networking — Implement protocol processing, packet handling and custom data-path acceleration using the large logic fabric and embedded memory.
• Embedded Compute & Acceleration — Offload compute-intensive tasks and implement custom accelerators or system controllers with the device's logic and RAM resources.

Unique Advantages

• High logic density: Approximately 300,000 logic elements enable implementation of complex, multi-function designs on a single device.
• Substantial on-chip memory: ~21.09 Mbits of embedded RAM reduce external memory dependencies and improve local data throughput.
• Extensive I/O count: 284 I/Os support a wide range of peripheral connections and multi-channel interfaces.
• Industrial temperature capability: Rated from -40 °C to 100 °C for reliable operation in demanding environments.
• Compact, surface-mount package: 484-FCBGA (19×19) provides a space-efficient footprint for high-density board designs.
• Low-voltage core: 0.970 V–1.080 V supply range facilitates integration into low-voltage power architectures.

Why Choose MPF300TL-FCVG484I?

The MPF300TL-FCVG484I positions itself for engineers who need a balanced combination of programmable logic capacity, embedded memory and broad I/O in an industrial-grade package. Its specifications support complex embedded applications and networking tasks while meeting temperature and environmental requirements for industrial deployments.

Designed for teams building scalable, robust systems, this PolarFire™ FPGA offers the on-chip resources to consolidate functions, reduce external components and streamline board-level integration—delivering long-term value through a high-density, industrial-rated programmable device.

Request a quote or submit a procurement inquiry to obtain pricing and availability for the MPF300TL-FCVG484I.