MPF300TL-FCVG484E

The MPF300TL-FCVG484E is a PolarFire™ FPGA IC from Microchip Technology in a 484-FCBGA (19×19) surface-mount package. It offers a high logic capacity and substantial on-chip memory with a large number of user I/O, suitable for designs that require dense programmable logic and embedded memory resources.

Key device-level characteristics include 300,000 logic elements, approximately 21.09 Mbits of embedded memory, 284 I/O pins, a low-voltage core range of 0.970–1.08 V, and an extended-grade operating temperature range of 0 °C to 100 °C. The device is RoHS compliant.

Key Features

• Core Logic — 300,000 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory — Approximately 21.09 Mbits of on-chip RAM for buffering, lookup tables, and data storage without external memory.
• I/O Density — 284 user I/O pins support connectivity to peripherals, sensors, and external interfaces.
• Power — Core voltage supply range from 0.970 V to 1.08 V to match system power-rail design requirements.
• Package & Mounting — 484-FCBGA (19×19) package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for a variety of commercial and industrial-adjacent environments.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Use the large logic element count for complex datapath and control logic implementations.
• On-chip buffering and memory-centric designs — Approximately 21.09 Mbits of embedded memory supports buffering, packet processing, and lookup operations without relying solely on external memory.
• I/O-rich systems — 284 I/Os enable integration with multiple peripherals, sensors, and interface standards on a single device.
• Compact, board-level FPGA integration — The 484-FCBGA surface-mount package facilitates dense PCB layouts where board real estate is constrained.

Unique Advantages

• High logic capacity: 300,000 logic elements allow consolidation of multiple functions into one FPGA, simplifying system architecture.
• Significant embedded memory: Approximately 21.09 Mbits of on-chip RAM reduces dependency on external memory and lowers system BOM complexity.
• Extensive I/O support: 284 I/Os provide flexible interfacing options for diverse peripherals and mixed-signal front-ends.
• Compact FCBGA package: The 484-FCBGA (19×19) package supports compact, surface-mount integration for space-constrained designs.
• Low-voltage core operation: 0.970–1.08 V supply range aligns with modern low-voltage power architectures.
• Extended-grade reliability: Rated for 0 °C to 100 °C operation to meet a broad range of environmental conditions.

Why Choose MPF300TL-FCVG484E?

The MPF300TL-FCVG484E positions itself as a high-capacity PolarFire FPGA option for designs that demand substantial programmable logic, embedded memory, and a large number of I/Os in a compact surface-mount package. Backed by Microchip Technology, this device is appropriate for engineers looking to consolidate functionality, reduce external memory needs, and implement I/O-heavy systems while maintaining an extended-grade operating range.

Its combination of 300,000 logic elements, approximately 21.09 Mbits of embedded memory, 284 I/Os, and a 484-FCBGA package makes it suitable for projects that require dense integration and on-chip resources, providing scalability and reduced board-level complexity.

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