MPF300TL-FCG784E

The MPF300TL-FCG784E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for high-density programmable logic applications. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to address designs that require significant logic capacity, embedded memory, and dense external connectivity.

Key value propositions include a large population of logic elements, approximately 21.1 Mbits of embedded memory, and a compact 784-FCBGA package, making the device suitable for complex digital systems where integration and form-factor are important.

Key Features

• Core Logic  Approximately 300,000 logic elements provide a high-density programmable fabric for complex logic implementations.
• Logic Blocks  A device architecture delivering 75,000 logic blocks (CLBs) for granular logic partitioning and design scalability.
• Embedded Memory  Approximately 21.1 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing without external memory.
• High I/O Count  388 user I/Os enable wide-area connectivity to peripherals, transceivers, and board-level interfaces.
• Package and Mounting  784-BBGA (784-FCBGA, 29×29) surface-mount package offers a compact footprint for board-level integration.
• Power Supply  Core voltage supply range of 0.970 V to 1.08 V to match platform power requirements and regulator designs.
• Temperature and Grade  Extended grade device specified for 0 °C to 100 °C operating temperature range.
• Compliance  RoHS compliant for environmental conformity in regulated assemblies.

Typical Applications

• High-density digital processing  Implement custom signal-processing pipelines and complex state machines using the device’s large logic element count and on-chip RAM.
• Communications and networking  Use the abundant I/O and embedded memory for packet buffering, protocol handling, and interface aggregation on communication boards.
• Embedded control and automation  Deploy the FPGA to consolidate control logic, real-time processing, and I/O interfacing in compact system designs.
• Prototyping and system integration  Leverage the device’s logic capacity and package density for hardware prototyping and integration of complex programmable functions.

Unique Advantages

• High logic capacity: Large population of logic elements enables implementation of complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: Approximately 21.1 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage tasks.
• Dense I/O footprint: 388 I/Os support broad peripheral connectivity and parallel interface implementations.
• Compact, high-density package: 784-FCBGA (29×29) package balances I/O count with a board-friendly footprint for space-constrained designs.
• Low core supply range: 0.970 V to 1.08 V core voltage window aligns with modern power-architecture choices for FPGA cores.
• Regulatory readiness: RoHS compliance helps meet environmental requirements for many commercial and industrial assemblies.

Why Choose MPF300TL-FCG784E?

The MPF300TL-FCG784E positions itself as a high-density FPGA solution for designers seeking a balance of logic capacity, embedded memory, and extensive I/O in a compact FCBGA package. Its specification set supports complex digital processing, substantial on-chip buffering, and flexible board-level interfacing while operating across an extended temperature window.

This device is suited for teams building scalable, integrated FPGA-based systems that require significant programmable resources and a compact footprint, with the assurance of Microchip Technology manufacturing and RoHS compliance for mainstream deployment scenarios.

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