MPF300TL-FCG484E

The MPF300TL-FCG484E is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides programmable logic resources, on-chip memory, and a high I/O count in a 484-FCBGA (23×23) package for surface-mount applications.

Key device attributes include 300,000 logic elements, approximately 21.1 Mbits of embedded memory, 244 I/Os, a nominal supply voltage range of 0.97 V to 1.08 V, and an operating temperature range of 0 °C to 100 °C. The device is offered in an Extended grade and is RoHS compliant.

Key Features

• Core Capacity 300,000 logic elements supporting complex programmable logic implementations.
• Embedded Memory Approximately 21.1 Mbits of on-chip RAM for data buffering and state storage.
• I/O Resources 244 user I/Os to support multiple external interfaces and board-level connectivity.
• Power Operating supply voltage range from 0.97 V to 1.08 V for core power domains.
• Package & Mounting 484-FCBGA (23×23) package in a surface-mount form factor for compact PCB integration.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory RoHS compliant.

Typical Applications

• Programmable logic and hardware acceleration — Implement custom logic functions and hardware accelerators using the device’s high logic capacity and embedded memory.
• I/O-dense interfaces — Use the 244 I/Os to aggregate and route multiple external interfaces or to manage board-level connectivity.
• Compact system integration — The 484-FCBGA package and surface-mount mounting enable space-efficient integration on populated PCBs.

Unique Advantages

• High logic density: 300,000 logic elements enable substantial on-chip processing and custom logic implementation.
• Substantial embedded memory: Approximately 21.1 Mbits of RAM support buffering, state machines, and data handling without external memory.
• Ample I/O: 244 programmable I/Os provide flexibility for multi-interface designs and signal routing.
• Low-voltage core operation: Core supply range of 0.97 V to 1.08 V supports modern low-voltage FPGA power domains.
• Compact BGA package: 484-FCBGA (23×23) package enables dense board layouts while maintaining connectivity options.
• Extended temperature grade: Rated for 0 °C to 100 °C to meet a range of environmental operating conditions.

Why Choose MPF300TL-FCG484E?

The MPF300TL-FCG484E delivers a combination of high logic capacity, significant embedded memory, and a large I/O complement in a compact 484-FCBGA surface-mount package. Its electrical and thermal specifications make it suitable for designs that require sizeable programmable logic resources and integrated on-chip RAM while operating within the stated supply and temperature ranges.

Backed by Microchip Technology, this PolarFire FPGA variant is positioned for engineers and procurement teams seeking a high-capacity, RoHS-compliant FPGA platform that supports dense integration and scalable design architectures.

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