MPF300T-FCVG484I

The MPF300T-FCVG484I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology, delivered in a 484-FCBGA (19×19) surface-mount package. It integrates 300,000 logic elements, approximately 21.09 Mbits of embedded memory, and 284 I/O pins to address mid-range programmable logic needs.

Built and specified for industrial use, this device operates over a −40°C to 100°C temperature range and accepts a core supply between 0.97 V and 1.08 V, making it suitable for industrial embedded systems that require substantial on-chip logic, memory, and I/O capacity in a compact package.

Key Features

• Core Logic  300,000 logic elements provide significant programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, frame storage, and intermediate data processing without external memory.
• I/O Count  284 I/O pins enable extensive peripheral interfacing and multi-channel connectivity for signal routing and control.
• Package and Mounting  484-FCBGA (19×19) package in a 484-BBGA footprint optimized for surface-mount PCB assembly and compact system integration.
• Power  Core supply range of 0.97 V to 1.08 V to match system power architectures that adhere to the specified voltage window.
• Industrial Grade Operating Range  Specified operating temperature from −40°C to 100°C for use in industrial environments.
• Manufacturer  Supplied by Microchip Technology, aligned with industry-standard FPGA form factors and manufacturing processes.

Typical Applications

• Industrial Automation  Use where on-chip logic density and multiple I/O are required for control, data aggregation, and real-time interfacing in industrial equipment.
• Embedded Processing  Suitable for systems that need substantial programmable logic and embedded memory to implement custom compute and data-path functions.
• Communications and Interfaces  Applicable to designs requiring 284 I/O connections for protocol bridging, parallel interfaces, or multi-channel signal routing.

Unique Advantages

• High Logic Density: 300,000 logic elements enable implementation of sizable logic networks and IP cores without immediate need for external programmable devices.
• Substantial On-Chip Memory: Approximately 21.09 Mbits of embedded RAM reduces external memory dependence for buffering and intermediate storage.
• Generous I/O Capacity: 284 I/O pins provide flexibility for complex interfacing, sensor arrays, and multi-channel connectivity.
• Industrial Temperature Specification: Rated for −40°C to 100°C operation to support deployment in demanding industrial environments.
• Compact FCBGA Package: 484-FCBGA (19×19) enables dense PCB layout and surface-mount assembly for space-constrained designs.
• Controlled Core Supply Range: Designed for core voltages between 0.97 V and 1.08 V to align with specified power delivery designs.

Why Choose MPF300T-FCVG484I?

The MPF300T-FCVG484I combines mid-range programmable logic capacity, substantial embedded memory, and a high I/O count in a compact 484-FCBGA package, all specified for industrial-temperature operation. These attributes make it well suited for industrial embedded systems and other applications that require robust on-chip resources and a reliable surface-mount form factor.

Engineers and procurement teams looking for a PolarFire™ FPGA solution with 300,000 logic elements, approximately 21.09 Mbits of on-chip RAM, and 284 I/Os will find this device appropriate for designs that prioritize integration, measurable memory resources, and industrial-grade temperature tolerance.

Request a quote or submit an inquiry to obtain pricing and availability for the MPF300T-FCVG484I.