MPF300T-FCVG484E
| Part Description |
PolarFire™ Field Programmable Gate Array (FPGA) IC 284 21094400 300000 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,684 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (19x19) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 284 | Voltage | 970 mV - 1.08 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 75000 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 21094400 |
Overview of MPF300T-FCVG484E – PolarFire™ Field Programmable Gate Array (FPGA) IC, 484-FCBGA
The MPF300T-FCVG484E is a PolarFire™ Field Programmable Gate Array (FPGA) from Microchip Technology. It combines a large logic fabric with on-chip memory and a substantial I/O count in a 484-ball FCBGA surface-mount package, designed for systems that require significant programmable logic capacity and integrated memory.
With 300,000 logic elements, approximately 21.09 Mbits of embedded memory, a 284-pin I/O complement, and a core voltage range of 0.97 V to 1.08 V, the device targets designs that need high-density programmable logic, flexible interfacing, and controlled core power characteristics.
Key Features
- Logic Capacity Provides 300,000 logic elements suitable for complex programmable logic implementations and high-density designs.
- Embedded Memory Approximately 21.09 Mbits (21,094,400 bits) of on-chip RAM to support buffering, state storage, and data-path implementations.
- I/O and Package 284 I/O pins in a 484-BBGA / 484-FCBGA (19×19) surface-mount package, enabling diverse external interfacing while minimizing board footprint.
- Power and Voltage Core voltage supply range of 0.970 V to 1.080 V to match low-voltage system designs and power budgets.
- Temperature and Grade Extended grade device rated for operation from 0 °C to 100 °C to meet a broad range of environmental conditions.
- Mounting and Compliance Surface-mount package and RoHS-compliant construction for modern PCB assembly processes and regulatory compliance.
Typical Applications
- Communications Equipment Use the device for protocol processing, packet handling, and custom interface logic where a high logic count and ample on-chip memory are required.
- High‑Performance Embedded Systems Implement hardware accelerators, custom compute pipelines, or system glue logic that benefit from large programmable logic resources and embedded RAM.
- Signal Processing and Data Acquisition Deploy for real-time data buffering, preprocessing, and format conversion leveraging the device’s memory and logic capacity.
- Prototyping and Custom SoC Integration Suitable for FPGA-based prototyping or integration of custom logic blocks within larger system designs that require many I/Os and dense logic.
Unique Advantages
- High Logic Density: 300,000 logic elements accommodate complex designs and reduce the need for multiple devices.
- Substantial On‑Chip Memory: Approximately 21.09 Mbits of embedded RAM supports large buffers and state machines without external memory.
- Generous I/O Count in Compact Package: 284 I/Os in a 484-FCBGA (19×19) package provide broad interfacing capability while keeping board area compact.
- Low-Voltage Core Operation: 0.97–1.08 V core supply range supports low-voltage system architectures and power-sensitive designs.
- Extended Operating Range: 0 °C to 100 °C operational rating and extended grade classification for deployments across a range of environments.
- RoHS Compliant: Meets RoHS requirements for environmentally compliant assembly and distribution.
Why Choose MPF300T-FCVG484E?
The MPF300T-FCVG484E positions itself as a high-capacity PolarFire FPGA option for engineers needing a balance of large logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its low-voltage core operation and extended temperature range make it suitable for designs that require controlled power characteristics and reliable operation across common environmental conditions.
This device is well suited to teams building communications equipment, embedded accelerators, signal-processing systems, or FPGA-based prototypes that demand scalability, on-chip memory, and strong interfacing capability. Microchip’s PolarFire family integration provides a consistent platform for development and long-term design continuity.
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