MPF300TL-FCG1152I

The MPF300TL-FCG1152I is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology, delivered in a 1152-FCBGA (35×35) surface-mount package. It provides a high-capacity programmable fabric combining a large number of logic elements, substantial embedded memory, and a wide I/O complement for complex digital designs.

Targeted for industrial-grade applications, this device offers a core supply voltage range of 970 mV to 1.08 V and an operating temperature range of −40 °C to 100 °C, making it suitable where robust thermal and electrical operating margins are required.

Key Features

• Logic Capacity  Approximately 300,000 logic elements and 75,000 CLBs to implement large, custom digital functions and system logic.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM for buffering, packet storage, and state retention within user logic.
• I/O Density  512 general-purpose I/O pins to interface with wide buses, multiple peripherals, or parallel data streams.
• Power  Core supply voltage range from 970 mV to 1.08 V to match system power-rail requirements and enable predictable power planning.
• Package and Mounting  1152-FCBGA (35×35) package in a surface-mount form factor for board-level integration and high pin count routing.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant to support restricted-substance requirements.

Unique Advantages

• High logic density: The large count of logic elements enables consolidation of multiple functions into a single FPGA, reducing overall system component count.
• Substantial embedded memory: Approximately 21.09 Mbits of on-chip RAM supports local buffering and deterministic data handling without relying solely on external memory.
• Extensive I/O capability: 512 I/O pins allow flexible interfacing to a variety of external devices and high-bandwidth parallel interfaces.
• Industrial-ready thermal range: Operation from −40 °C to 100 °C makes the device suitable for industrial deployments where temperature resilience is required.
• Compact, high-pin-count package: The 1152-FCBGA (35×35) package balances board-level density with routing capability for complex designs.
• Controlled core supply range: A defined 0.97–1.08 V core supply simplifies power supply planning and helps ensure consistent device behavior.

Why Choose MPF300TL-FCG1152I?

The MPF300TL-FCG1152I is positioned for designs that require a combination of high logic capacity, significant embedded memory, and large I/O count within an industrial-grade FPGA package. Its specified operating temperature range and RoHS compliance make it a practical choice for long-lived deployments where environmental robustness and regulatory alignment are considerations.

Engineers selecting this device benefit from a dense programmable fabric and a compact, high-pin-count FCBGA package that supports integration of complex digital subsystems while maintaining predictable electrical and thermal requirements.

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