MPF300T-FCVG484T2

The MPF300T-FCVG484T2 is a PolarFire™ field programmable gate array (FPGA) IC from Microchip Technology. It provides a high-density programmable fabric with 300,000 logic elements and approximately 21.6 Mbits of embedded memory for compute- and I/O-intensive embedded systems.

With 284 user I/Os, a 484‑ball BFBGA package, and AEC‑Q100 qualification for automotive use, this device targets designs that require extensive logic integration, significant on‑chip RAM, and extended temperature operation.

Key Features

• Logic Capacity — 300,000 logic elements and 75,000 CLBs (configurable logic blocks) for complex programmable logic and fabric-based functions.
• On‑Chip Memory — Approximately 21.6 Mbits of embedded RAM to support large buffering, packet processing, and state storage within the FPGA fabric.
• I/O Density — 284 user I/Os to connect multiple peripherals, sensors, and high‑pin‑count interfaces directly to the FPGA.
• Package and Mounting — 484‑BFBGA (484‑FBGA, 19×19) surface‑mount package optimized for board‑level integration.
• Voltage Supply — Core supply range from 0.970 V to 1.08 V to match system power rails and power‑management schemes.
• Automotive Qualification & Temperature — Automotive grade with AEC‑Q100 qualification and an operating junction temperature from –40 °C to 125 °C.
• RoHS Compliance — Device is RoHS compliant for environmental and regulatory requirements.
• Programming Note — PolarFire device programming functions (programming, verify, and digest check) are only allowed over the Industrial temperature range regardless of the temperature grade selected, as documented in the PolarFire datasheet.

Typical Applications

• Automotive Systems — AEC‑Q100 qualification and extended temperature support make this device suitable for automotive control domains that require programmable logic and significant on‑chip memory.
• Embedded Control and Sensor Processing — High logic density and abundant I/O enable real‑time sensor fusion, signal conditioning, and custom control implementations.
• Communications and Networking — Large embedded RAM and high I/O count support packet buffering, custom protocol handling, and interface bridging.
• Industrial Electronics — Extended operating temperatures and surface‑mount BFBGA package fit ruggedized and space‑constrained industrial designs.

Unique Advantages

• Substantial Logic and Fabric Capacity: 300,000 logic elements provide headroom for complex algorithms, custom accelerators, and large control logic blocks.
• Significant On‑Chip Memory: Approximately 21.6 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying BOM and board layout.
• High I/O Integration: 284 user I/Os enable dense peripheral and sensor connectivity without extensive external multiplexing.
• Automotive‑Grade Reliability: AEC‑Q100 qualification and –40 °C to 125 °C operating range support deployment in automotive environments requiring broad temperature tolerance.
• Compact, Board‑Ready Package: 484‑BFBGA (19×19) surface‑mount package facilitates compact PCB designs while supporting high pin counts.
• Regulatory Compliance: RoHS compliance addresses environmental and manufacturing requirements for modern product development.

Why Choose MPF300T-FCVG484T2?

The MPF300T-FCVG484T2 combines high logic density, substantial embedded memory, and a large I/O complement in an automotive‑qualified PolarFire FPGA package. It is suited to designers who need scalable programmable logic, on‑chip RAM for buffering and stateful processing, and the environmental robustness required for automotive and industrial platforms.

Built on the PolarFire family and documented in the PolarFire datasheet and user guides, this device provides a verifiable hardware platform for designs that prioritize integration, temperature tolerance, and predictable electrical requirements.

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