MPF300T-FCSG536I

The MPF300T-FCSG536I is a PolarFire™ Field Programmable Gate Array (FPGA) IC designed for reconfigurable digital logic applications. It provides a high-density combination of logic, embedded memory and I/O in a compact 536-LFBGA (536-CSPBGA, 16×16) surface-mount package, targeted at industrial-grade applications.

Key on-chip resources include 300,000 logic elements, approximately 21.09 Mbits of embedded memory, and 300 user I/Os, with a core supply range of 0.97 V to 1.08 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  300,000 logic elements and 75,000 CLBs provide a large fabric for implementing complex, reconfigurable digital designs.
• Embedded Memory  Approximately 21.09 Mbits of on-chip RAM to support buffering, data storage and algorithm acceleration inside the FPGA fabric.
• I/O Density  300 user I/Os enable broad interfacing options for peripherals, sensors and high-pin-count systems.
• Package & Mounting  Supplied in a 536-LFBGA (536-CSPBGA, 16×16) surface-mount package for compact board integration and high pin density.
• Power  Core supply voltage range from 0.97 V to 1.08 V to match system power-rail requirements and designs with defined low-voltage domains.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for environments requiring extended temperature capability.
• Compliance  RoHS compliant, supporting regulatory requirements for reduced hazardous substances.

Typical Applications

• Industrial Automation & Control  Reconfigurable logic and plentiful I/O make the device suitable for control systems and industrial data processing that require operation across −40 °C to 100 °C.
• Embedded Processing & Custom Acceleration  Large logic capacity and on-chip RAM enable implementation of custom hardware accelerators and embedded processing functions within a single FPGA.
• High-density Interface Aggregation  With 300 I/Os and a compact 536-LFBGA package, the FPGA can consolidate multiple interfaces and bridge complex signals on space-constrained PCBs.

Unique Advantages

• High Logic Capacity: 300,000 logic elements and 75,000 CLBs allow integration of large digital functions without partitioning across multiple devices.
• Substantial Embedded Memory: Approximately 21.09 Mbits of on-chip RAM reduces the need for external memory for many buffering and storage tasks.
• Robust Industrial Operation: Rated for −40 °C to 100 °C and designated industrial grade for deployments that require extended temperature performance.
• Dense I/O in a Compact Package: 300 I/Os in a 536-CSPBGA (16×16) footprint help minimize board area while maximizing connectivity.
• Low-voltage Core Support: Core supply range of 0.97 V to 1.08 V enables designs using constrained power rails and careful power budgeting.
• RoHS Compliant: Meets RoHS requirements for reduced hazardous substance content in assemblies.

Why Choose MPF300T-FCSG536I?

The MPF300T-FCSG536I positions a high-density PolarFire™ FPGA fabric in an industrial-grade, compact package that combines significant logic capacity, ample embedded memory and extensive I/O. Its electrical and thermal specifications make it suited to designs that require sizable on-chip resources while operating across extended temperature ranges.

This device is well suited for developers and system designers who need scalable programmable logic, substantial on-chip RAM and dense I/O in a single surface-mount package—supporting consolidation of functions and reducing board-level complexity.

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