MPF300T-FCG784I

The MPF300T-FCG784I is a PolarFire™ Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It delivers a large programmable fabric with 300,000 logic elements, approximately 21.09 Mbits of embedded memory, and 388 user I/O to support complex, high-density digital designs.

Packaged in a 784-FCBGA (29×29) surface-mount package and rated for industrial temperature operation, the device targets industrial systems requiring robust logic capacity, sizable on-chip RAM, and a broad I/O footprint, while operating on a 0.97–1.08 V core supply.

Key Features

• Logic Capacity — 300,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory — Approximately 21.09 Mbits of on-chip RAM to support buffering, frame storage, and state machines without external memory for many use cases.
• I/O Density — 388 user I/O pins for extensive peripheral connectivity and multi-channel interfacing in system designs.
• Power — Core supply requirement of 0.97 V to 1.08 V, enabling integration into low-voltage power domains.
• Package & Mounting — 784-FCBGA supplier device package (29×29) in a surface-mount form factor suitable for compact, high-density PCB layouts.
• Industrial Temperature Grade — Specified operating range from −40°C to 100°C for reliable performance in industrial environments.
• Regulatory Compliance — RoHS-compliant to meet common environmental and regulatory requirements.

Typical Applications

• Industrial Control Systems — High logic density and extensive I/O make the device suitable for motor control, programmable logic controllers, and factory automation interfaces where on-chip memory and I/O count reduce external component needs.
• Data and Communications Infrastructure — Large logic and embedded RAM support packet processing, protocol bridging, and I/O aggregation tasks in networking equipment.
• Test & Measurement — The combination of sizable logic resources and many I/Os enables custom signal processing, data capture, and instrument control in industrial test setups.

Unique Advantages

• High Integration: 300,000 logic elements and approximately 21.09 Mbits of embedded memory reduce reliance on external components and lower system BOM complexity.
• Broad I/O Footprint: 388 user I/O pins enable multi-channel sensor, actuator, and peripheral interfaces without extensive external multiplexing.
• Industrial Reliability: Specified for −40°C to 100°C operation, making it a fit for temperature-demanding industrial deployments.
• Compact Packaging: 784-FCBGA (29×29) surface-mount package supports dense PCB layouts for space-constrained designs.
• Regulatory Ready: RoHS compliance simplifies design for regions and customers requiring environmentally compliant components.

Why Choose MPF300T-FCG784I?

MPF300T-FCG784I positions itself as a high-capacity, industrial-grade FPGA option within the PolarFire family from Microchip Technology. Its large logic resource pool, substantial embedded memory, and extensive I/O count make it well suited for engineers designing complex industrial systems, communications equipment, or advanced test instruments that require on-chip resources and a robust operating temperature range.

For teams seeking a solution that balances integration, I/O flexibility, and industrial robustness, this device offers a clear platform to scale logic and memory requirements while maintaining compact board-level implementation and RoHS compliance.

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